Advanced Materials for Flexible Sensing Applications and Electronics
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 November 2025 | Viewed by 16
Special Issue Editors
Interests: flexible electronics; bioinspired functional surfaces; MEMS sensors
Special Issues, Collections and Topics in MDPI journals
Interests: bioinspired sensing devices based on materials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Flexible sensing electronics play a crucial role as the primary mediums through which high-end equipment perceives external information. Today, flexible sensing devices based on various functional sensing materials or innovative structural designs provide broad potential applications in human–machine interaction, smart healthcare, and advanced mechanical systems. However, current sensing materials and structures still require further improvements to meet the increasing demands of real-world applications, including enhanced sensitivity, durability, and multifunctionality. This Special Issue aims to present the latest research advancements in advanced sensing materials and structures for applications in wearable electronics, robotic skin, intelligent machinery, and beyond. Topics of interest include but are not limited to, novel material design, flexible and stretchable sensors, self-powered sensing technologies, and integrated multifunctional sensor systems. We invite researchers to submit original research to this Special Issue.
Dr. Linpeng Liu
Dr. Changchao Zhang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible strain sensor
- flexible pressure sensor
- sensing microstructure
- sensing functional surfaces
- sensing strain materials
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.