materials-logo

Journal Browser

Journal Browser

Reinforced Polymer Composites with Natural and Nano Fillers

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Composites".

Deadline for manuscript submissions: 10 June 2026 | Viewed by 650

Special Issue Editors


E-Mail
Guest Editor
Institute of Corrosion Science and Technology, Guangzhou 510530, China
Interests: electrically conductive adhesives (ECAs); resin-based composite materials; conductive polymers; corrosion-resistant materials and coatings

E-Mail
Guest Editor
Department of Mechanical Engineering, The University of Hong Kong, Hong Kong 999077, China
Interests: electrochromic energy storage device; bioelectronics; hydrogel electronics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Polymer composites reinforced with natural and nano fillers have attracted significant attention due to their potential to combine high performance with sustainability. Natural fibers and bio-based fillers offer low density, renewability, and cost-effectiveness, while nanomaterials such as nano-clays, carbon nanotubes, graphene, and metal oxides contribute to enhanced mechanical, thermal, barrier, and functional properties. The synergy between natural and nano fillers opens new avenues for designing advanced composite systems suitable for structural and multifunctional applications across automotive, aerospace, marine, packaging, and biomedical fields.

This Special Issue aims to present the latest developments in the synthesis, processing, characterization, and application of reinforced polymer composites using natural and/or nano fillers. We welcome original research articles, reviews, and communications on topics including, but not limited to, interface engineering, hybrid filler systems, biodegradable composites, surface modification of fillers, and performance optimization. Contributions that explore green processing methods and promote environmental sustainability are particularly encouraged.

We look forward to your valuable contributions to this Special Issue.

Dr. Ge Cao
Dr. He Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • conductive polymers
  • natural fiber composites
  • nanofiller reinforcement
  • biodegradable composites
  • interface engineering
  • hybrid filler systems
  • surface modification of fillers
  • green processing technologies
  • sustainable polymer materials
  • multifunctional nanocomposites
 

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

16 pages, 3810 KB  
Article
Array-Patterned Anisotropic Conductive Films for High Precision Circuit Interconnection
by Changxiang Hao, Junde Chen, Yonghao Chen, Ge Cao, Xing Cheng and Yanqing Tian
Materials 2025, 18(21), 4927; https://doi.org/10.3390/ma18214927 - 28 Oct 2025
Viewed by 401
Abstract
Anisotropic conductive films (ACFs) are widely used for circuit interconnection due to their easy use, low temperature bonding, higher precision than soldering and eco-friendliness. However, current ACFs are generally prepared by randomly distributing conductive particles into suitable resins. The ACFs prepared by this [...] Read more.
Anisotropic conductive films (ACFs) are widely used for circuit interconnection due to their easy use, low temperature bonding, higher precision than soldering and eco-friendliness. However, current ACFs are generally prepared by randomly distributing conductive particles into suitable resins. The ACFs prepared by this approach have risks to result in shortcut when applied for high precision bonding (<100 μm). In order to alleviate this problem, we designed and prepared a new kind of ACFs with conducting particles well aligned in adhesive film, which is named as array-patterned ACFs (A-ACFs). A template with 12 μm periodic microcavities was prepared and used to load 5.4 μm silver-coated polystyrene particles. Through a series of process optimizations including particles-filling cycles and particles-transferring-pressure/temperature into the used polyurethane (PU) adhesive, well-aligned particles with a spacing of 6.6 μm in the PU film was obtained. Such prepared A-ACFs were used to bond two flexible printed circuits (FPC) not only with a spacing of 200 μm (FPC-200) but also with 40 μm (FPC-40). The bonding conditions including temperature and pressure for the FPC-200 connections were investigated in detail. The connecting resistance, insulation resistance, peeling force, and the particles’ morphologies between the bonded FPCs were investigated. The reliability of the two bonded FPCs were tested under 85 °C and 85% relative humidity. Results showed that the new kinds of A-ACFs are suitable for achieving high precision circuits bonding and show better accuracy than those of traditional ACFs (T-ACFs). Thus, this study might have new insight for designing A-ACFs and great potential for applications in high-precision devices. Full article
(This article belongs to the Special Issue Reinforced Polymer Composites with Natural and Nano Fillers)
Show Figures

Figure 1

Back to TopTop