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Current and Emerging Semiconductor Materials for Applications in MEMS and Flexible Intelligent Sensors

This special issue belongs to the section “Electronic Materials“.

Special Issue Information

Dear Colleagues,

We invite you to contribute your research on advanced materials and devices for micro-electro-mechanical systems (MEMSs) to this Special Issue. Micro-electro-mechanical systems (MEMSs) integrate micro-sensors, micro-actuators, micro-mechanical structures, micro-power supplies, and high-performance electronic devices, typically measuring just a few millimeters or smaller. They have revolutionized modern technology, serving as the foundational building blocks for a vast array of applications, from inertial navigation and biomedical sensors to optical communication and environmental monitoring. The performance, reliability, and commercial viability of MEMS devices are intrinsically linked to the materials from which they are fabricated and the innovative design of the devices themselves. While silicon has been the workhorse of the MEMS industry, the relentless pursuit of materials with higher performance, multi-functionality, and the capability to operate in harsh environments is driving the exploration of novel materials and groundbreaking device architectures. The integration and fabrication of advanced materials—including wide-bandgap semiconductors, piezoelectric thin films, 2D materials, metamaterials, and functional polymers—is revealing unprecedented capabilities and opening new developments for MEMS technology.

This Special Issue aims to capture cutting-edge research and development at the intersection of materials science and MEMS technology and provide an international platform for scientists and engineers to disseminate their latest findings on the design, fabrication, characterization, and application of advanced materials in MEMS devices. This issue will foster interdisciplinary dialogue and accelerate innovation by highlighting breakthroughs that push the boundaries of what is possible in micro- and nano-scale electromechanical systems. With this in mind, we invite you to share your research, advancements, and discoveries in this Special Issue entitled “Advanced Materials and Devices for micro-electro-mechanical systems (MEMSs)”. We look forward to receiving your contributions and addressing areas related to innovative materials and devices.

Dr. Chen Wu
Dr. Xudong Fang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro/nanosensors
  • actuators
  • advanced functional materials
  • mems fabrication technology
  • mems sensing mechanisms
  • material characterization
  • simulation and testing
  • material calculation
  • flexible electronic
  • optics sensors
  • internet of things
  • sensor packaging technology

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Materials - ISSN 1996-1944