Thermal Management and Characterization in Electronics
A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".
Deadline for manuscript submissions: closed (1 July 2021) | Viewed by 4531
Special Issue Editors
Interests: LED testing; thermal simulation; electro-thermal simulation; logi-thermal simulation; multi-domain modeling
Special Issues, Collections and Topics in MDPI journals
Interests: thermal investigation of ICs and MEMS; thermal sensors; thermal testing; thermal simulation; thermal model generation; electro-thermal simulation; CPS systems
Special Issues, Collections and Topics in MDPI journals
Interests: electric engineering; electro-thermal circuit modeling and simulation; electromagnetic simulation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
As a follow-up to the 26th THERMINIC Workshop, held in Berlin in September 2020, a Special Issue of energies about thermal and multi-physical investigations electronics systems will be edited by Prof. Marta Rencz, Prof. Lorenzo Codecasa and Prof. Andras Poppe.
This Special Issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to through multi-physics simulation to cooling solutions and reliability assessment.
This special issue is not only collecting papers from the 26th THERMINIC Workshop, but also will containing papers from other scholars who interested in this topic. Papers that were presented at THERMINIC must be revised and contain at least 60% new material that has never been presented before.
Prof. Andras Poppe
Prof. Dr. Márta Rencz
Prof. Lorenzo Codecasa
Guest Editors
Manuscript Submission Information
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Keywords
- multi physics simulation and field coupling
- thermal modelling and investigation of packages
- thermal interface materials and their characterization
- thermal management and characterization of electronic components and systems
- high temperature electronics
- thermal issues in power electronics
- thermal issues in solid state lighting
- CFD modelling and benchmarking
- thermal performance of interconnects
- electro-thermal interactions
- temperature mapping
- 3D integration and cooling concepts
- thermo-mechanical reliability
- lifetime modelling and prediction
- prognostics and health monitoring
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