Special Issue "Selected Papers from Modelica Conference 2021"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 31 July 2022.

Special Issue Editors

Dr. Martin Sjölund
E-Mail Website
Guest Editor
Department of Computer and Information Science (IDA), Linköping University, SE-581 83 Linköping, Sweden
Interests: software and systems (SAS); programming environments; debugging, modeling and simulation, programming language design
Prof. Dr. Peter Fritzson
E-Mail Website
Guest Editor
Department of Computer and Information Science, Linköpings University, SE-581 83 Linköping, Sweden
Interests: software engineering, especially programming languages; high-level specification and modeling languages; programming and debugging tools and environments; parallel and multicore computing, compilers and compiler generators; tools and languages for object-oriented equation-based modeling and simulation; Modelica language
Special Issues, Collections and Topics in MDPI journals
Dr. Lena Buffoni
E-Mail Website
Guest Editor
Department of Computer and Information Science (IDA), Linköping University, SE-581 83 Linköping, Sweden
Interests: language construction; requirement modeling; synchronous languages
Dr. Adrian Pop
E-Mail Website
Guest Editor
Department of Computer and Information Science, Linköpings University, 581 83 Linköping, Sweden
Interests: programming languages (design, implementation, debugging, etc.) and integrated development tools
Dr. Lennart Ochel
E-Mail Website
Guest Editor
RISE, 501 15 Borås, Sweden
Interests: FMI and SSP based simulation environments (OpenModelica compiler and OMSimulator) and autonomous drones and drone swarm applications

Special Issue Information

Dear Colleagues,

The Modelica Conference is the main event for users, library developers, tool vendors, and language designers to share their knowledge and learn about the latest scientific and industrial progress related to Modelica, the Functional Mockup Interface (FMI), System Structure and Parametrization (SSP), Distributed Co-Simulation Protocol (DCP), and eFMI.

Since the start of the collaborative design work for Modelica in 1996, Modelica has matured from an idea among a small number of dedicated enthusiasts to a widely accepted standard language for the modeling and simulation of cyber-physical systems.
The Modelica language was standardized by the non-profit Modelica Association, which enabled Modelica models to be portable between a growing number of tools.
Modelica is the language of choice for model-based systems engineering and is now used in many industries, including automotive, energy and process, aerospace, and industrial equipment.

The Modelica Association has since grown to include several projects supporting modeling and simulation, creating a family of inter-related standards complementing each other.
FMI is an open standard that defines a container and an interface to exchange dynamic models using a single file (an FMU).
SSP is a tool-independent standard to define complete systems consisting of one or more FMUs, including its parameterization, which can be transferred between simulation tools.
DCP is a platform and standard for the integration of models or real-time systems into simulation environments.
The eFMI tool enables the automatic transformation of higher-level acausal model representations (such as Modelica) to causal solutions suitable for integration in embedded systems.

Dr. Martin Sjölund
Prof. Dr. Peter Fritzson
Dr. Lena Buffoni
Dr. Adrian Pop
Dr. Lennart Ochel
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • cyber-physical systems
  • modeling and simulation
  • Modelica
  • model-based systems

Published Papers

This special issue is now open for submission.
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