Special Issue "Precision Dimensional Measurements"

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: 31 October 2018

Special Issue Editors

Guest Editor
Prof. Dr. Kuang-Chao Fan

Department of Mechanical Engineering, National Taiwan University, Taipei 10617, Taiwan
Website | E-Mail
Interests: precision metrology, precision machine design, machine tool accuracy
Guest Editor
Prof. Dr. Liang-Chia Chen

Department of Mechanical Engineering, National Taiwan University, 10617 Taipei
Website | E-Mail
Interests: precision metrology and manufacturing; automated optical inspection (AOI); opto-mechatronics instrumentation and 3-D machine vision and algorithms for automation

Special Issue Information

Dear Colleagues,

Precision dimensional measurements conventionally play a critical role in workshop quality control. Although there are many instruments on the market for a variety of measuring demands, such as lengths, angles, regular forms, free forms, special geometries, and 2D and 3D, in practice, however, not all products can be easily measured by current instruments and technologies. Sensors and precision stages for measurements are varied. Some cutting-edge manufacturing processes have produced many difficult-to-measure parts, such as complex geometry, mini-to-micro-sized, tight tolerance, high aspect ratio, large scaled, soft surface, etc. Some new measurement sciences and technologies are urgently needed to cope with these parts.

This Special Issue welcomes any papers revealing novel measurement methodologies and instrumentations for precision dimensional measurements of precision products, including new measuring machines, new sensors, on-machine measurements, on-line or in-situ measurements, micro/nano measurements, accuracy enhancement, error compensation, uncertainty analyses, etc. Detailed design principles in sciences, and technological applications in high-tech industries, are required in submitted manuscripts.

Topics may cover, but are not limited to, the following areas:

  1. Length measurements from macro- to micro- to nano-scales.
  2. Form measurements from 2D to 3D, from analytical to free forms, from small to large, etc.
  3. Design of new measuring machines for dimensional measurements.
  4. Optical measurements, such as triangulation method, image processing, confocal microscopy, white light microscopy, hybrid types, interferometers, etc.
  5. On-machine measurements, on-line or in-situ measurements
  6. New types of error compensation strategy.

Prof. Dr. Kuang-Chao Fan
Prof. Dr. Liang-Chia Chen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Dimensional measurements
  • Length measurement
  • Angle measurements
  • Form measurements
  • 3D measurements
  • Optical measurements
  • On-machine measurements
  • On-line measurements

Published Papers (3 papers)

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Research

Open AccessArticle Precision Manufacturing of Patterned Beryllium Bronze Leaf Springs via Chemical Etching
Appl. Sci. 2018, 8(9), 1476; https://doi.org/10.3390/app8091476
Received: 30 June 2018 / Revised: 22 August 2018 / Accepted: 22 August 2018 / Published: 28 August 2018
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Abstract
Patterned leaf springs made of a beryllium bronze sheet are the key components of certain micro/nano contact probes. The accuracy of the probe is determined based on the precision of the formed pattern. However, a traditional manufacturing method using wire-electrode discharge machining (wire-EDM)
[...] Read more.
Patterned leaf springs made of a beryllium bronze sheet are the key components of certain micro/nano contact probes. The accuracy of the probe is determined based on the precision of the formed pattern. However, a traditional manufacturing method using wire-electrode discharge machining (wire-EDM) is subject to poor tolerance at the sharp edges and corners. In addition, high energy consumption and costs are incurred for complex patterns. This paper presents a new chemical etching method for the manufacturing of a patterned leaf spring with high precision. Both the principle and process are introduced. Taguchi experiments were designed and conducted and the optimal process parameters were obtained based on the mean value and a variance analysis. Four V-shaped and some other complex patterned leaf springs were successfully fabricated. Comparison experiments concerning the characteristic parameters of the leaf spring were also conducted. The experimental results reveal that the patterned leaf springs manufactured through this method are much better than those achieved using wire-EDM. This manufacturing method can be used to fabricate different high-precision patterned leaf springs or membranes for coordinate measuring machines (CMM) probes and other measuring equipment. Full article
(This article belongs to the Special Issue Precision Dimensional Measurements)
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Open AccessArticle Calibration Method of Orthogonally Splitting Imaging Pose Sensor Based on General Imaging Model
Appl. Sci. 2018, 8(8), 1399; https://doi.org/10.3390/app8081399
Received: 2 July 2018 / Revised: 26 July 2018 / Accepted: 6 August 2018 / Published: 19 August 2018
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Abstract
Orthogonally splitting imaging pose sensor is a new sensor with two orthogonal line array charge coupled devices (CCDs). Owing to its special structure, there are distortion correction and imaging model problems during the calibration procedure. This paper proposes a calibration method based on
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Orthogonally splitting imaging pose sensor is a new sensor with two orthogonal line array charge coupled devices (CCDs). Owing to its special structure, there are distortion correction and imaging model problems during the calibration procedure. This paper proposes a calibration method based on the general imaging model to solve these problems. The method introduces Plücker Coordinate to describe the mapping relation between the image coordinate system and the world coordinate system. This paper solves the mapping relation with radial basis function interpolation and adaptively selecting control points with Kmeans clustering method to improve the fitting accuracy. This paper determines the appropriate radial basis function and its shape parameter by experiments. And these parameters are used to calibrate the orthogonally splitting imaging pose sensor. According to the calibration result, the root mean square (RMS)of calibration dataset and the RMS of test dataset are 0.048 mm and 0.049 mm. A comparative experiment is conducted between the pinhole imaging model and the general imaging model. Experimental results show that the calibration method based on general imaging model applies to the orthogonally splitting imaging pose sensor. The calibration method requires only one image corresponding to the target in the world coordinates and distortion correction is not required to be taken into account. Compared with the calibration method based on the pinhole imaging model, the calibration procedure based on the general imaging model is easier and accuracy is greater. Full article
(This article belongs to the Special Issue Precision Dimensional Measurements)
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Open AccessArticle Non-Contact and Real-Time Measurement of Kolsky Bar with Temporal Speckle Interferometry
Appl. Sci. 2018, 8(5), 808; https://doi.org/10.3390/app8050808
Received: 17 April 2018 / Revised: 27 April 2018 / Accepted: 15 May 2018 / Published: 17 May 2018
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Abstract
In this paper, a new non-contact and real-time measurement system for Kolsky bars is presented. This system uses two sets of temporal speckle interferometry in-plane displacement measurement devices to replace two strain gauges of conventional Kolsky bars. The in-plane displacement measurement of the
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In this paper, a new non-contact and real-time measurement system for Kolsky bars is presented. This system uses two sets of temporal speckle interferometry in-plane displacement measurement devices to replace two strain gauges of conventional Kolsky bars. The in-plane displacement measurement of the Kolsky bar is mainly intended to provide a new test method for the dynamic mechanical properties of small-size material samples with diameters below 2 mm. This method is non-contact, does not require any intermediate medium, and can make the Kolsky bar applicable to characterizing the dynamic mechanical properties of materials under higher strain rates and smaller size conditions. The measuring devices and principles are described. In addition, a preliminary experiment is carried out to demonstrate the performance of this new device. Full article
(This article belongs to the Special Issue Precision Dimensional Measurements)
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