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Appl. Sci. 2019, 9(2), 242; https://doi.org/10.3390/app9020242

Ultraprecision Diameter Measurement of Small Holes with Large Depth-To-Diameter Ratios Based on Spherical Scattering Electrical-Field Probing

Center of Ultra-Precision Optoelectronic Instrument, Harbin Institute of Technology, Harbin 150080, China
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Received: 6 December 2018 / Revised: 28 December 2018 / Accepted: 6 January 2019 / Published: 10 January 2019
(This article belongs to the Special Issue Precision Dimensional Measurements)
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Abstract

In order to solve the difficulty of precision measurement of small hole diameters with large depth-to-diameter ratios, a new measurement method based on spherical scattering electrical-field probing (SSEP) was developed. A spherical scattering electrical field with identical sensing characteristics in arbitrary spatial directions was formed to convert the micro gap between the probing-ball and the part being measured into an electrical signal. 3D non-contact probing, nanometer resolution, and approximate point probing—which are key properties for high measurement precision and large measurable depth-to-diameter ratios—were achieved. A specially designed hole diameter measuring machine (HDMM) was developed, and key techniques, including laser interferometry for macro displacement measurement of the probe, multi-degree-of-freedom adjustment of hole attitude, and measurement process planning, are described. Experiments were carried out using the HDMM and a probing sensor with a ϕ3-mm probing ball and a 150-mm-long stylus to verify the performance of the probing sensor and the measuring machine. The experimental results indicate that the resolution of the probing sensor was as small as 1 nm, and the expanded uncertainty of measurement result was 0.2 μm (k = 2) when a ϕ20-mm ring gauge standard was measured. View Full-Text
Keywords: small hole diameter; depth-to-diameter ratio; spherical scattering electrical-field probing; hole diameter measuring machine small hole diameter; depth-to-diameter ratio; spherical scattering electrical-field probing; hole diameter measuring machine
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Bian, X.; Cui, J.; Lu, Y.; Tan, J. Ultraprecision Diameter Measurement of Small Holes with Large Depth-To-Diameter Ratios Based on Spherical Scattering Electrical-Field Probing. Appl. Sci. 2019, 9, 242.

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