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5 pages, 663 KB

Open AccessProceeding Paper

Contactless Respiratory Monitoring Using Acoustic Convolutional Neural Network Classification

by Kirill Kurskiy, Yuanying Qu, Minzhang Liu and Jiafeng Zhou

Eng. Proc. 2026, 127(1), 1; https://doi.org/10.3390/engproc2026127001 - 24 Feb 2026

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Abstract

Continuous respiratory monitoring plays a crucial role in both clinical and non-clinical applications, providing valuable insights into physiological health. This paper presents a sustainable, contactless respiratory monitoring framework that integrates acoustic sensing with a lightweight convolutional neural network (CNN) optimized for low-power embedded platforms. Breathing sounds are processed using wavelet-based denoising and Mel-Frequency Cepstral Coefficient (MFCC) extraction, achieving 94.8% classification accuracy with an inference latency of 0.3 s per frame. The quantized model deployed on a Sony Spresense microcontroller reduces memory usage by over 90%. By eliminating disposable sensors and minimizing energy consumption, the proposed approach delivers an eco-efficient, scalable, and real-time solution for continuous respiratory assessment. Full article

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7 pages, 694 KB

Open AccessProceeding Paper

Life Cycle Assessment of Epitaxy of GaN-on-SiC High-Electron-Mobility Transistors for Advanced Radio Frequency Applications

by Max Mosig, Stefan Müller and Rüdiger Quay

Eng. Proc. 2026, 127(1), 2; https://doi.org/10.3390/engproc2026127002 - 24 Feb 2026

Abstract

From 4G to 5G to 6G, every few years, a new generation of data transmission technology emerges to meet the growing demand for faster and more efficient communication. Artificial intelligence, the Internet of Things and the increasing need for global connectivity are the key drivers of this evolution, pushing both research and industry toward ever-higher data rates. These advanced technologies already consume vast amounts of resources and energy, relying on high-tech nano-fabrication processes such as metal–organic chemical vapor deposition, dry etching, deposition and lithography, all of which typically occur in energy-intensive cleanroom environments. This study evaluates the epitaxy process of GaN on SiC for high-electron-mobility transistor (HEMT) devices and integrated circuits using life cycle assessment. GaN HEMTs offer high efficiency and excellent thermal conductivity, paving the way for reduced chip footprints for lower energy consumption. This analysis enables informed decision-making regarding sustainability by providing detailed data and interpretation of Fraunhofer IAF’s GaN-on-SiC HEMT technology. Full article

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5 pages, 852 KB

Open AccessProceeding Paper

Hydrogel-Based Conductive Inks for the Additive Printing of Biodegradable Radiofrequency Electronic Circuits

by Álvaro Méndez-Espinosa, Sergio Ortiz-Ruiz, Mikel G. Palomo, Francisco Pasadas, Laura Rodríguez-Arco, Modesto T. López-López and Francisco G. Ruiz

Eng. Proc. 2026, 127(1), 3; https://doi.org/10.3390/engproc2026127003 - 25 Feb 2026

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Abstract

Biodegradable hydrogel-based conductive inks, with application in additive circuit manufacturing, are synthesized from agarose, sodium alginate and functional carbon-based particles (carbon nanotubes and graphite). Rheological measurements are conducted to evaluate the printing performance of each ink. The synthesized functional inks are printed, and their conductivity properties are evaluated as a function of the functional material concentration. Promising conductivity values are achieved, demonstrating their potential application for low-cost and low-environmental-impact circuital and electromagnetic designs. Full article

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6 pages, 502 KB

Open AccessProceeding Paper

Investigation of E-Waste Management Practices to Promote Circularity: A Case Study from Sri Lanka

by Kuruppuge Themiya, Kulatunga K. Asela and Luis Martino

Eng. Proc. 2026, 127(1), 5; https://doi.org/10.3390/engproc2026127005 - 26 Feb 2026

Abstract

This study examines the e-waste management practices in Sri Lanka, using a comparative approach that considers the entire e-waste management supply chain. A systematic review was carried out by examining the existing policy implementations and regulations and the current formal and informal waste management practices established in Sri Lanka and by comparing collection levels globally and across selected developed and developing countries. This study demonstrates how regulatory bodies currently intervene from manufacturing to the end of product life and how stakeholders are involved in e-waste management. This work reveals the policy, regulations, and institutional capacity gaps in establishing proper e-waste management in Sri Lanka. While Sri Lanka faces some similar challenges to other developing countries, like dependence on informal collection, differences in policy frameworks, and institutional capacity, this may imply that generalized solutions fail to capture some important national variations. Full article

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4 pages, 620 KB

Open AccessProceeding Paper

Side Chain Engineering of a Solution-Processed Non-Acidic Hole Transport Material for Organic Electronics

by Joseph Cameron, Neil J. Findlay, Rupert G. D. Taylor, Anto R. Inigo and Peter J. Skabara

Eng. Proc. 2026, 127(1), 6; https://doi.org/10.3390/engproc2026127006 - 27 Feb 2026

Abstract

Organic semiconductors have the potential to contribute to sustainable electronics manufacture due to their ability to be processed from low-energy solution-processing methods. However, improvements must be made in the lifetime of such devices. PEDOT:PSS, a popular hole transport material, is acidic, which causes degradation in devices over time. Therefore, a replacement is needed to allow for longer lasting organic semiconductor devices. We have previously reported BEDOTPy, a non-acidic, molecular material that could be used to improve the device lifetime of OLEDs. In this work we explore how molecular engineering of BEDOTPy, by modifying the molecule’s side chain, affects the physical properties that are important to device performance and lifetime. Full article

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