- Article
Comparison of Cobalt Integration with Various Dielectric Materials under Thermal and Electrical Stress
- Yi-Lung Cheng,
- Hong-Chang Huang,
- Wei-Fan Peng,
- Giin-Shan Chen and
- Jau-Shiung Fang
Cobalt (Co) is proposed to replace copper (Cu) as a conductor in the back-end-of-line (BEOL) interconnects of integrated circuits. In this study, the electric characteristics and reliability of the integration of Co with various dielectric films (SiO...

