- Article
Material Properties of Zr–Cu–Ni–Al Thin Films as Diffusion Barrier Layer
- Po-Hsien Sung and
- Tei-Chen Chen
Due to the rapid increase in current density encountered in new chips, the phenomena of thermomigration and electromigration in the solder bump become a serious reliability issue. Currently, Ni or TiN, as a barrier layer, is widely academically studi...

