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Article

Application of Robust, Packaged Long-Period Fiber Grating for Strain Measurement

Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 807, Taiwan
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Author to whom correspondence should be addressed.
Academic Editors: Teen-Hang Meen, Shoou-Jinn Chang, Stephen D. Prior and Artde Donald KinTak Lam
Micromachines 2016, 7(8), 129; https://doi.org/10.3390/mi7080129
Received: 1 June 2016 / Revised: 11 July 2016 / Accepted: 19 July 2016 / Published: 26 July 2016
This paper proposes an optical fiber strain sensor based on packaged long-period fiber gratings (PLPFG) which is fabricated by the micro-electromechanical systems (MEMS) process and packaged with poly-dimethylsiloxane (PDMS) polymer materials. The optical fiber sensor packaged with PDMS improves robustness effectively. The proposed PLPFG sensors have periods of 610, 650, 660 μm and fiber diameter of 48, 60, 72 μm, respectively. The resonance dip of the PLPFG grows when a strain loaded onto the sensor. The results show that the largest strain sensitivity of the PLPFG strain sensor was −0.0652 dB/με from 0–1200 με and the linearity (R2) was 0.9812. Accordingly, the proposed PLPFG sensor has good potential for high-sensitivity strain sensing applications. View Full-Text
Keywords: optical fiber sensor; long-period fiber grating; strain sensor optical fiber sensor; long-period fiber grating; strain sensor
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MDPI and ACS Style

Ma, K.-P.; Wu, C.-W.; Hsieh, T.-S.; Hsieh, M.-Y.; Chiang, C.-C. Application of Robust, Packaged Long-Period Fiber Grating for Strain Measurement. Micromachines 2016, 7, 129. https://doi.org/10.3390/mi7080129

AMA Style

Ma K-P, Wu C-W, Hsieh T-S, Hsieh M-Y, Chiang C-C. Application of Robust, Packaged Long-Period Fiber Grating for Strain Measurement. Micromachines. 2016; 7(8):129. https://doi.org/10.3390/mi7080129

Chicago/Turabian Style

Ma, Ke-Ping, Chao-Wei Wu, Tso-Sheng Hsieh, Min-Yuan Hsieh, and Chia-Chin Chiang. 2016. "Application of Robust, Packaged Long-Period Fiber Grating for Strain Measurement" Micromachines 7, no. 8: 129. https://doi.org/10.3390/mi7080129

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