A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
1
Department of Mechanical Engineering, State University of New York at Binghamton, P.O. Box 6000, Binghamton, NY 13902, USA
2
Analog Devices, Inc., Wilmington, MA 01887, USA
*
Authors to whom correspondence should be addressed.
†
These authors contributed equally to this work.
Academic Editor: Stefano Mariani
Sensors 2017, 17(2), 322; https://doi.org/10.3390/s17020322
Received: 1 November 2016
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Revised: 9 January 2017
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Accepted: 16 January 2017
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Published: 9 February 2017
(This article belongs to the Collection Modeling, Testing and Reliability Issues in MEMS Engineering)
Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranked for this TSV structure by FEA modeling. Parametric studies for material properties (modulus and thermal expansion) of TSV polymer are performed. The second type is a high aspect ratio TSV filled by polycrystalline silicon (poly Si). Potential risks of the voids in the poly Si due to filling defects are studied. Fracture mechanics methods are utilized to evaluate the risk for two different assembly conditions: package assembled to printed circuit board (PCB) and package assembled to flexible substrate. The effect of board/substrate/die thickness and the size and location of the void are discussed.
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Keywords:
MEMS packaging; optical sensor; TSV; reliability; finite element analysis (FEA); fracture mechanics
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MDPI and ACS Style
Shao, S.; Liu, D.; Niu, Y.; O’Donnell, K.; Sengupta, D.; Park, S. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors 2017, 17, 322. https://doi.org/10.3390/s17020322
AMA Style
Shao S, Liu D, Niu Y, O’Donnell K, Sengupta D, Park S. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors. 2017; 17(2):322. https://doi.org/10.3390/s17020322
Chicago/Turabian StyleShao, Shuai, Dapeng Liu, Yuling Niu, Kathy O’Donnell, Dipak Sengupta, and Seungbae Park. 2017. "A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications" Sensors 17, no. 2: 322. https://doi.org/10.3390/s17020322
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