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Journal: Sensors, 2017
Volume: 17
Number: 322
Article:
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
Authors:
by
Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O’Donnell, Dipak Sengupta and Seungbae Park
Link:
https://www.mdpi.com/1424-8220/17/2/322
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