Next Article in Journal
mDARAL: A Multi-Radio Version for the DARAL Routing Algorithm
Next Article in Special Issue
Testing of Piezo-Actuated Glass Micro-Membranes by Optical Low-Coherence Reflectometry
Previous Article in Journal
Hyperspectral Image Classification with Spatial Filtering and \(l_{(2,1)}\) Norm
Previous Article in Special Issue
Topologically Optimized Nano-Positioning Stage Integrating with a Capacitive Comb Sensor
 
 

Order Article Reprints

Journal: Sensors, 2017
Volume: 17
Number: 322

Article: A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
Authors: by Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O’Donnell, Dipak Sengupta and Seungbae Park
Link: https://www.mdpi.com/1424-8220/17/2/322

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop