Search Results (908)

Hexagonal boron nitride nanosheets (BNNSs) have emerged as one of the most promising materials for next-generation thermal management, driven by the intensifying heat dissipation demands of highly integrated electronics. While conventional polymer-based packaging materials are lightweight and electrically insulating, their intrinsically low thermal conductivity severely limits effectiveness in high-power devices. The remarkable thermal transport, wide bandgap, chemical robustness, and mechanical strength of BNNSs offer a compelling solution. This review provides a comprehensive overview of the structural and physical foundations that underpin the anisotropic yet exceptional thermal properties of bulk h-BN and BNNSs. We examine major synthesis routes including tape exfoliation, ball milling, liquid-phase exfoliation, chemical vapor deposition, and metal–organic chemical vapor deposition, highlighting how process mechanisms govern nanosheet thickness, defect density, crystallinity, and scalability. Particular emphasis is placed on the advantages of BNNSs in thermal management systems, from their use as high-efficiency thermally conductive fillers and advanced thermal interface materials. We conclude by examining key challenges including large-area growth, filler alignment, and interfacial engineering, and by presenting future research directions that could enable the practical deployment of BNNSs-based thermal management technologies. Full article

Agave lechuguilla fibers exhibit high tensile strength, low density and durability, but their use in natural rubber composites is underexplored. This study investigates alkaline-treated fibers (149–180 µm) as reinforcements for natural latex. Fibers were pretreated with a methanol–acetone mixture, followed by immersion in 10% NaOH at 70 °C for 1 h, removing lignin and hemicellulose as confirmed by FTIR and SEM. Thermogravimetric analysis showed three weight-loss stages: moisture/volatiles (9.4%), hemicellulose (peak at 341 °C), and cellulose/lignin (peak at 482 °C), with <3% residue above 500 °C. Treated composites exhibited enhanced tensile strength (4.68 ± 1.2 MPa vs. 1.3 ± 0.8 MPa for untreated) and elongation at break (530 ± 51% vs. 452 ± 32%). Hardness increased from 21.8 (neat latex) to 30.3, and compression resistance was improved. Optical microscopy revealed strong fiber–matrix adhesion with uniform dispersion. Alkaline treatment enhances interfacial bonding and mechanical performance, making A. lechuguilla fibers a sustainable reinforcement for eco-friendly composites in automotive, construction, and packaging sectors. Full article

Mycelium-based composites are self-grown biodegradable materials, made using agricultural residue fibers that are inoculated with fungi mycelium. The mycelium forms an interwoven three-dimensional filamentous network, binding every fiber particle together to create a rigid, lightweight composite material. Although having potential in packaging and in the construction industry, mycelium composites encounter molding limitations due to fiber size and oxygen access which hinder design capabilities and market engagement. To cope with these limitations, this study reports an alternative way to form mycelium composite using cut precultivated mycelium composite panels, laminated to biologically fuse into a unique assembly. By controlling the growth conditions of the mycelium network, it is possible to adjust physical properties such as flexural strength and strain energy density. These mycelium composite panels were fabricated from hemp fibers and Ganoderma lucidum mushroom. Seven different growth conditions were tested to increase layer adhesion and create the strongest assembly. Three-point flexural tests were conducted on ten samples extracted from each assembled panel triplicate set. The data collected in this study suggested that cultivating an opaque layer of mycelium on the surface of the panel before stacking can enhance total strain energy density by approximately 60%, compared to a single-layer mycelium composite of identical size. In addition, this eliminates abrupt material failure by dividing failure behavior into multiple distinct stages. Finally, by layering multiple thinner layers, the resulting mycelium composite could contain even higher mycelium proportions exhibiting augmented mechanical properties and higher design precisions opening market possibilities. Full article

This work presents an analytical homogenization model developed to predict the tensile and bending behavior of double-wall corrugated cardboard. The proposed approach replaces the complex three-dimensional geometry, composed of five paper layers, with an equivalent two-dimensional homogenized plate. Based on lamination theory and enhanced by sandwich structure theory, the model accurately captures the orthotropic behavior of the material. To achieve this objective, three configurations of double-wall corrugated cardboard were investigated: KRAFT LINER (KL), DUOSAICA (DS), and AUSTRO LINER (AL). A comprehensive experimental characterization campaign was conducted, including physical analyses (density measurement, SEM imaging, and XRD analysis) and mechanical testing (tensile tests), to determine the input parameters required for the homogenization process. The proposed model significantly reduces geometric complexity and computational cost while maintaining excellent predictive accuracy. Validation was performed by comparing the results of a 3D finite element model (ANSYS-19.2) with those obtained from the homogenized H-2D model. The differences between both approaches remained systematically below 2%, confirming the ability of the H-2D model to accurately reproduce the axial and flexural stiffnesses of double-wall corrugated cardboard. The methodology provides a reliable and efficient framework specifically dedicated to the mechanical analysis and optimization of corrugated cardboard structures used in packaging applications. Full article

Bidirectional switches are highly required power electronics units for the design of power converters, especially for direct matrix converters. This article presents the design and implementation of a compact bidirectional switch based on SiC-MOSFET technology, aimed at high-efficiency, high-density power electronics applications. The proposed architecture employs surface-mount components, optimizing both the occupied area and electrical performance. The selected switching device is the IMBG120R053M2H from Infineon, a SiC-MOSFET known for its low on-resistance, high reverse-voltage blocking capability, and excellent switching speed. To drive the power devices, the UCC21521 gate driver integrates two independent isolated outputs in a single package, enabling precise control and reduced electromagnetic interference (EMI). The developed design supports bidirectional current conduction and voltage blocking, offering a robust and scalable solution for next-generation power converters. Design criteria, simulation results, and experimental validations are discussed. Full article

Mechanical damage and microbial contamination are major challenges in the postharvest logistics of perishable fruit. In this study, two types of functionally modified chitosan-based aerogel pads were developed to enhance cushioning and preservation of wax apples. A chitosan/polyvinyl alcohol (CP) aerogel was first optimized by adjusting solid content, CS:PVA ratio, and crosslinker concentration. The optimal formulation (2% solids, 1:1 CS: PVA, 3% glutaraldehyde) exhibited a uniform porous structure and improved compressive strength. A chitosan/montmorillonite (CM) aerogel with 5% montmorillonite (MMT) showed high porosity, low density, and excellent cyclic stability. Incorporating 10% copper nanoparticle-loaded antibacterial fibers (CuNPs-TNF) into CM aerogels yielded CM-Cu aerogels with enhanced cushioning and antimicrobial properties. Under simulated transport and cold storage conditions, all aerogel-packaged groups reduced mechanical damage and decay of wax apples. Compared to the control, the CM-Cu group showed 66% lower decay, 5% less weight loss, 6 N greater firmness, 7% less juice yield, and a 13% reduction in relative electrical conductivity. Additionally, it better preserved fruit color and total soluble solids, extending shelf life by 4 d at 20 °C. These results demonstrate the potential of chitosan-based aerogels as multifunctional packaging materials that combine mechanical protection with antimicrobial activity for perishable fruit preservation. Full article

This study presents the development of a smart packaging material utilizing garlic-derived nitrogen-doped carbon dots (CDs) integrated into a whey protein–starch (WP-S) emulsion. The research aimed to create a real-time, non-invasive biosensor capable of detecting microbial spoilage. The synthesized CDs demonstrated strong pH-sensitive photoluminescence, exhibiting distinct changes in CIE coordinates and fluorescence intensity in response to varying pH values. The WP-S-CDs emulsion was tested against E. coli, S. aureus, and C. albicans. The results showed that the composite film provided a clear colorimetric shift and fluorescence quenching, both of which are directly correlated with microbial metabolic activity. The physical and electronic properties of the composite were investigated to understand the sensing mechanism. Scanning electron microscopy (SEM) of the dried film revealed that the WP-S-CDs system formed a more porous structure with larger pore sizes (3.63–8.18 µm) compared to the control WP-S film (1.62–6.52 µm), which facilitated the rapid diffusion of microbial metabolites. Additionally, density functional theory (DFT) calculations demonstrated that the incorporation of CDs significantly enhanced the composite’s electronic properties by reducing its band gap and increasing its dipole moment, thereby heightening its reactivity and sensitivity to spoilage byproducts. In a practical application on apples, the WP-S-CDs coating produced a visible red spot, confirming its function as a dynamic sensor. The material also showed a dual-action antimicrobial effect, synergistically inhibiting C. albicans while exhibiting an antagonistic effect against bacteria. These findings validate the potential of the WP-S-CDs emulsion as a powerful, multi-faceted intelligent packaging system for food quality monitoring. Full article

Empty fruit bunches (EFBs) and kenaf are two abundant sources of lignocellulosic resource agricultural waste with potential as substrates for mycelium-based composites (MBCs). These composites are lightweight, compostable, low-cost, and suitable for packaging applications. However, their performance is highly dependent on the type of lignocellulosic substrate and the processing conditions applied during production. Despite the promising availability of natural fibers, limited research has focused on the drying process that affects the quality of MBCs. This study investigates the effect of different drying times (12, 18, and 24 h) on the physical and mechanical properties of MBCS produced from EFB and kenaf substrates. Following a 20-day incubation period under controlled conditions, the composites were oven-dried and analyzed for mycelial colonization, density measurement, shrinkage, water loss, shore A hardness, impact resistance, and mold growth. The results demonstrated that a drying time of 24 h yielded the best overall performance. Moisture loss (67.00%) and shrinkage (50.70%) increased with longer drying times (24 h), particularly in kenaf-based composites. Extended drying minimized mold contamination and enhanced the structural integrity of the composites. Overall, EFB-based composites achieved the highest Shore A hardness (44.53 HA). These findings show that optimizing the drying time enhances the durability of MBCs, reinforcing their potential as sustainable, biodegradable alternatives to polystyrene and promoting the development of eco-friendly materials. Full article

Active biopolymer-based packaging incorporating phytochemicals offers promising sustainable alternatives for reducing postharvest losses and extending food shelf life. This study aimed to advance natural food packaging by (i) developing and characterizing natural deep eutectic solvents (NADES) using choline chloride combined with citric acid (CC-CA), glucose (CC-G), and urea (CC-U); (ii) obtaining bioactive extracts from Uxi bark and Jambolan leaves using these NADES; (iii) formulating babassu mesocarp-based coatings enriched with CC-CA extracts; and (iv) evaluating their application on cherry tomatoes. CC-U exhibited the lowest density (1.152 ± 0.037 g cm⁻³), while CC-G demonstrated the highest viscosity (18.375 ± 0.430 mPa s), and CC-CA presented the lowest polarity parameter (E_NR) value (44.6 ± 0.1 kcal mol⁻¹). Extracts obtained with CC-CA (YU-CA and JL-CA) showed high extraction efficiency, strong antioxidant activity (DPPH inhibition > 95%), and antimicrobial activity, particularly against Pseudomonas aeruginosa. Although the coatings exhibited lower bioactivity than the extracts, they effectively reduced weight loss, maintained firmness, and preserved the microbiological quality of tomatoes for up to 9 days. Sensory analysis of bruschetta prepared with coated tomatoes indicated high acceptance (>80%). Babassu mesocarp-based coatings enriched with Amazonian plant extracts emerge as an innovative active packaging strategy aligned with the 2030 Agenda. Full article

TiC-reinforced red mud–alumina composite ceramics were fabricated by spark plasma sintering. The materials exhibited excellent mechanical properties when incorporating 4 wt.% TiC and sintering at 1100 °C, achieving a flexural strength of 675.81 MPa, Vickers hardness of 2137.2 HV, relative density of 96.79%, and fracture toughness of 7.65 MPa·m^1/2. Microstructural characterization reveals that the enhanced mechanical performance is attributed to the in situ formation of CaAl₁₂O₁₉ and the development of a unique intragranular microstructure with Al₂O₃ grains. The composites demonstrated non-wetting behavior against molten copper, maintaining interfacial stability without detectable reactions or elemental interdiffusion at elevated temperatures. This work provides an effective strategy for valorizing red mud in fabricating high-performance ceramics suitable for electronic packaging applications. Full article

This article presents the design of a perovskite photovoltaic (PV)-based power management system, which uses a power converter (a four-stage bootstrap charge pump) to boost the output of the solar cell and supply selectable rectified power rails to CMOS image sensor circuit blocks. A perovskite photovoltaic, also known as a perovskite solar cell (PSC) was fabricated in the laboratory. The PSC has an open-circuit voltage of 1.14 V, short-circuit current of 1.24 mA, maximum power of 0.88 mW, and a current density of 20.68 mA/cm² at 62% fill factor. These measured forward scan parameters were closely reproduced with a solar cell simulation model. In a Cadence simulation that used 180 nm CMOS process, the power converter efficiently boosts the maximum output voltage of the PSC from 0.85 V to a rectified 3.7 V. Stage modulation and level shifting enable selectable output rails in the 1.2–3.3 V range to supply the image sensor circuit blocks. Keeping the output capacitance of the power converter much larger than the flying capacitance reduces the ripple voltage to approximately 73 µV, much smaller than the typical 1 mV in several other literatures. Through simulation, this work demonstrates the concept of directly using PSC (to be implemented on an outer ‘packaging’, not on a die) to supply CMOS image sensor power rails, in the same sense as in wearable devices and other consumer devices. This work highlights a path toward self-powered image sensors with improved conversion efficiency, compactness, and adaptability in low-light and variable operating environments. Full article

Poly(lactic acid) (PLA) has strong potential for use in sustainable packaging, automotive components, and structural materials; however, its inherent brittleness and limited thermal stability restrict broader application. To overcome these drawbacks, this study developed PLA-based composites reinforced with mica and compatibilized using poly(vinyl butyral) (PVB). To overcome the inherent brittleness and limited thermal stability of poly(lactic acid) (PLA), this study investigated the incorporation of mica as a reinforcing filler into PLA and PLA/poly(vinyl butyral) (PVB) composite systems. Five types of mica with varying particle sizes and densities were examined to evaluate their influence on the mechanical, thermal, and rheological properties of the composites. The PLA/PVB blend was prepared in an 8:2 weight ratio, and mica was added at 5 phr (35 g). PLA/mica composites showed limited improvement in mechanical performance due to poor interfacial compatibility between PLA and mica, resulting in decreased tensile strength and non-uniform filler dispersion. In contrast, the addition of PVB, a tough and flexible polymer containing hydroxyl groups (ca. 20 mol%) remaining after polymerization, significantly enhanced the interfacial interaction with mica and improved filler dispersion within the matrix. As a result, PLA/PVB/mica composites exhibited increased tensile strength and toughness. Thermal analysis revealed that mica restricted polymer chain mobility, leading to higher glass transition temperatures, while PVB promoted a more uniform crystalline structure. Rheological studies indicated that PLA/PVB/mica composites had higher complex viscosity and lower melt flow index (MFI) due to increased molecular interactions and reduced chain mobility. Notably, certain mica types containing Ca²⁺ ions catalyzed chain scission during melt processing, leading to reduced molecular weight and increased MFI. These findings demonstrate that the synergistic combination of PVB and mica can effectively improve the processability and performance of PLA-based composites, offering a promising route for developing sustainable materials for advanced applications. Full article

This work presents a highly compact and scalable 1.2-kV SiC MOSFET half-bridge building-block module enabled by a die-integrated 3D PCB packaging technology. Compared with conventional DBC-based or TO-247-based SiC half-bridge modules, the proposed design reduces the physical volume and weight by more than 90% while maintaining full compatibility with standard PCB manufacturing processes. The vertically laminated DC+/DC− conductors and symmetric PCB–die–PCB stack establish a tightly confined commutation loop, resulting in a measured power-loop inductance of 2.2 nH and a 3.8 nH gate-loop inductance—representing up to 94% and 89% reduction relative to discrete device implementations. Because the parasitic parameters are intrinsically well-balanced across replicated units and the mutual inductance between adjacent modules remains extremely small, the structure naturally supports current sharing during parallel operation. Thermal and insulation evaluations further confirm the suitability of copper filling via high-Tg laminated PCB substrates for high-power SiC applications, achieving withstand voltages exceeding twice the rated bus voltage. The proposed module is experimentally validated through finite-element parasitic extraction and 950 V double-pulse testing, demonstrating controlled dv/dt behavior and robust switching performance. This work establishes a manufacturable and parallel-friendly packaging approach for high-density SiC power conversion systems. Full article

Microplastics are very small particles of plastics, usually smaller than 5 mm. Microplastic pollution has emerged as a rising and challenging issue worldwide, posing serious threats to aquatic and terrestrial ecosystems and human health. Because of global demand and frequent use in daily routines, including clothing, packaging, and household items, the production of plastic is increasing annually. This study provides a comprehensive overview of the source, classification (based on shape, color, polymer), transportation, and impact of microplastic pollution. Depending upon size, mass, and density, microplastics can be transported to the environment via air and water. However, microplastics can be inhaled and ingested by humans, causing various health issues; for example, aquatic organisms like small fish ingest microplastics, which accumulate through the food chain and end up in the human body. This can lead to physiological harm, including inflammation, digestion tract obstruction, biomagnification throughout the food chain, and reproductive failure. This study further highlighted initiatives taken by government agencies to address plastic and microplastic pollution across India; for example, The Ministry of Environment Forest and Climate Change (MoEFCC) has formulated and amended the Plastic Waste Management (PWM) rules, Mission LiFE (LiFEStyle for Environment) launched campaigns such as “Say No to Single Use Plastic” and “One Nation, One Mission: End Plastic Pollution” to create awareness at the grassroot level, and institutions like the Food Safety and Standards Authority of India (FSSAI) have initiated a project to detect microplastics in food products. In addition, the National Green Tribunal (NGT) has instructed the Central Pollution Control Board (CPCB) to actively take measures to address microplastic pollution across Indian cities, focusing on key parameters like air, water, food, and humans. This study presents several recommendations, including detection and removal techniques (conventional, advanced, and removal); strengthening legislative policies such as Extended Producer Responsibility (EPR); research collaboration and monitoring with institutions such as CSIR-IITR, ICAR-CIFT, and BITS-Pilani; integrating EPR and Material Recovery Facilities (MRF) to develop a circular economy model; and mass awareness through government initiatives like the Swachh Bharat and Smart City programs to foster long-term behavioral change. Full article

The increasing power density of 2.5D and 3D chiplets imposes severe thermal constraints that have a direct impact on the performance and long-term reliability of high-performance computing systems. Stacked and laterally integrated dies, which generate hundreds of watts per package, create localized hotspots and inconsistent temperature fields, major obstacles to scalable heterogeneous integration. Research efforts have addressed these challenges by finite element and compact heat modeling, thermal interface material optimization (TIM), and advanced cooling solutions such as micro-channel liquid cooling and cold racks. While these approaches provide valuable insights, most remain case-specific, focusing on isolated packages or single design variables, and lack a general methodology for assessing thermal feasibility at an early stage. This review consolidates and critically analyzes contributions to thermal modeling at the package level, interposer thermal spreading, thermal characterization of TIMs, and the development of cooling technologies. A comparative review of published studies indicates a consistent threshold: 2.5D stacks are viable under air cooling at approximately 300 W, whereas 3D stacks require liquid or hybrid cooling in conjunction with high-performance thermal interface materials at about 350 W. The investigations identify interposer conductivity, thermal interface material thickness, and hotspot power distribution as the primary sensitivity elements. This study explores Thermal Feasibility Maps (TFMs), defined as multidimensional charts parameterized by architecture, cooling regime, and material stack. TFMs provide a systematic framework for comparing design trade-offs and support architecture cooling co-design in advanced chiplet systems. Full article