Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits i...
Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed....
Ultrafine spherical Ag powders with narrow particle size distribution, high tap density, and limited agglomeration are important conductive fillers for advanced photovoltaic paste formulation. Current liquid-phase reduction scale-up is limited by unc...