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Search Results (3,091)

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Keywords = metal semiconductor metal

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12 pages, 5808 KiB  
Article
A High-Precision Hydrogen Sensor Array Based on Pt-Modified SnO2 for Suppressing Humidity and Oxygen Interference
by Meile Wu, Zhixin Wu, Hefei Chen, Zhanyu Wu, Peng Zhang, Lin Qi, He Zhang and Xiaoshi Jin
Chemosensors 2025, 13(8), 294; https://doi.org/10.3390/chemosensors13080294 (registering DOI) - 7 Aug 2025
Abstract
Humidity and oxygen have significant impacts on the accuracy of hydrogen detection, especially for metal oxide semiconductor sensors at room temperature. Addressing this challenge, this study employs a screen-printed 1 × 2 resistive sensor array made from an identical 1 wt.% platinum-modified tin [...] Read more.
Humidity and oxygen have significant impacts on the accuracy of hydrogen detection, especially for metal oxide semiconductor sensors at room temperature. Addressing this challenge, this study employs a screen-printed 1 × 2 resistive sensor array made from an identical 1 wt.% platinum-modified tin oxide nanoparticle material. Fabrication variability between the two sensing elements was intentionally leveraged to enhance array output differentiation and information content. Systematic hydrogen-sensing tests were conducted on the array under diverse oxygen and moisture conditions. Three distinct feature types—the steady-state value, resistance change, and area under the curve—were extracted from the output of each array element. These features, integrated with their quotient, formed a nine-feature vector matrix. A multiple linear regression model based on this array output was developed and validated for hydrogen prediction, achieving a coefficient of determination of 0.95, a mean absolute error of 125 ppm, and a mean relative standard deviation of 7.07%. The combined information of the array provided significantly more stable and precise hydrogen concentration predictions than linear or nonlinear models based on individual sensor features. This approach offers a promising path for mass-producing highly interference-resistant, precise, and stable room-temperature hydrogen sensor arrays. Full article
(This article belongs to the Section Materials for Chemical Sensing)
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19 pages, 7494 KiB  
Article
Fowler–Nordheim Tunneling in AlGaN MIS Heterostructures with Atomically Thin h-BN Layer Dependence and Performance Limits
by Jiarui Zhang, Yikun Li, Shijun Luo, Yan Zhang, Man Luo, Hailu Wang and Chenhui Yu
Nanomaterials 2025, 15(15), 1209; https://doi.org/10.3390/nano15151209 - 7 Aug 2025
Abstract
Hexagonal Boron Nitride (h-BN) is an exceptional dielectric material with significant potential for high-performance electronic and optoelectronic devices. While previous studies have explored its role in GaN-based MIS (metal/insulator/semiconductor) structures, the influence of few-layer h-BN on AlGaN MIS devices—particularly with [...] Read more.
Hexagonal Boron Nitride (h-BN) is an exceptional dielectric material with significant potential for high-performance electronic and optoelectronic devices. While previous studies have explored its role in GaN-based MIS (metal/insulator/semiconductor) structures, the influence of few-layer h-BN on AlGaN MIS devices—particularly with varying Al compositions—remains unexplored. In this work, we systematically investigate the Fowler–Nordheim tunneling effect in few-layer h-BN integrated into AlGaN MIS architectures, focusing on the critical roles h-BN layer count, AlGaN alloy composition, and interfacial properties in determining device performance. Through combined simulations and experiments, we accurately determine key physical parameters, such as the layer-dependent effective mass and band alignment, and analyze their role in optimizing MIS device characteristics. Our findings reveal that the 2D h-BN insulating layer not only enhances breakdown voltage and reduces leakage current but also mitigates interfacial defects and Shockley–Read–Hall recombination, enabling high-performance AlGaN MIS devices under elevated voltage and power conditions. This study provides fundamental insights into h-BN-based AlGaN MIS structures and advances their applications in next-generation high-power and high-frequency electronics. Full article
(This article belongs to the Special Issue Wide Bandgap Semiconductor Material, Device and System Integration)
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23 pages, 2295 KiB  
Review
Advances in Interfacial Engineering and Structural Optimization for Diamond Schottky Barrier Diodes
by Shihao Lu, Xufang Zhang, Shichao Wang, Mingkun Li, Shuopei Jiao, Yuesong Liang, Wei Wang and Jing Zhang
Materials 2025, 18(15), 3657; https://doi.org/10.3390/ma18153657 - 4 Aug 2025
Viewed by 229
Abstract
Diamond, renowned for its exceptional electrical, physical, and chemical properties, including ultra-wide bandgap, superior hardness, high thermal conductivity, and unparalleled stability, serves as an ideal candidate for next-generation high-power and high-temperature electronic devices. Among diamond-based devices, Schottky barrier diodes (SBDs) have garnered significant [...] Read more.
Diamond, renowned for its exceptional electrical, physical, and chemical properties, including ultra-wide bandgap, superior hardness, high thermal conductivity, and unparalleled stability, serves as an ideal candidate for next-generation high-power and high-temperature electronic devices. Among diamond-based devices, Schottky barrier diodes (SBDs) have garnered significant attention due to their simple architecture and superior rectifying characteristics. This review systematically summarizes recent advances in diamond SBDs, focusing on both metal–semiconductor (MS) and metal–interlayer–semiconductor (MIS) configurations. For MS structures, we critically analyze the roles of single-layer metals (including noble metals, transition metals, and other metals) and multilayer metals in modulating Schottky barrier height (SBH) and enhancing thermal stability. However, the presence of interface-related issues such as high densities of surface states and Fermi level pinning often leads to poor control of the SBH, limiting device performance and reliability. To address these challenges and achieve high-quality metal/diamond interfaces, researchers have proposed various interface engineering strategies. In particular, the introduction of interfacial layers in MIS structures has emerged as a promising approach. For MIS architectures, functional interlayers—including high-k materials (Al2O3, HfO2, SnO2) and low-work-function materials (LaB6, CeB6)—are evaluated for their efficacy in interface passivation, barrier modulation, and electric field control. Terminal engineering strategies, such as field-plate designs and surface termination treatments, are also highlighted for their role in improving breakdown voltage. Furthermore, we emphasize the limitations in current parameter extraction from current–voltage (I–V) properties and call for a unified new method to accurately determine SBH. This comprehensive analysis provides critical insights into interface engineering strategies and evaluation protocols for high-performance diamond SBDs, paving the way for their reliable deployment in extreme conditions. Full article
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11 pages, 492 KiB  
Article
Ultra-Small Temperature Sensing Units with Fitting Functions for Accurate Thermal Management
by Samuel Heikens and Degang Chen
Metrology 2025, 5(3), 46; https://doi.org/10.3390/metrology5030046 - 1 Aug 2025
Viewed by 155
Abstract
Thermal management is an area of study in electronics focused on managing temperature to improve reliability and efficiency. When temperatures are too high, cooling systems are activated to prevent overheating, which can lead to reliability issues. To monitor the temperatures, sensors are often [...] Read more.
Thermal management is an area of study in electronics focused on managing temperature to improve reliability and efficiency. When temperatures are too high, cooling systems are activated to prevent overheating, which can lead to reliability issues. To monitor the temperatures, sensors are often placed on-chip near hotspot locations. These sensors should be very small to allow them to be placed among compact, high-activity circuits. Often, they are connected to a central control circuit located far away from the hot spot locations where more area is available. This paper proposes sensing units for a novel temperature sensing architecture in the TSMC 180 nm process. This architecture functions by approximating the current through the sensing unit at a reference voltage, which is used to approximate the temperature in the digital back end using fitting functions. Sensing units are selected based on how well its temperature–current relationship can be modeled, sensing unit area, and power consumption. Many sensing units will be experimented with at different reference voltages. These temperature–current curves will be modeled with various fitting functions. The sensing unit selected is a diode-connected p-type MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with a size of W = 400 nm, L = 180 nm. This sensing unit is exceptionally small compared to existing work because it does not rely on multiple devices at the sensing unit location to generate a PTAT or IPTAT signal like most work in this area. The temperature–current relationship of this device can also be modeled using a 2nd order polynomial, requiring a minimal number of trim temperatures. Its temperature error is small, and the power consumption is low. The range of currents for this sensing unit could be reasonably made on an IDAC. Full article
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28 pages, 4980 KiB  
Review
Intelligent Gas Sensors for Food Safety and Quality Monitoring: Advances, Applications, and Future Directions
by Heera Jayan, Ruiyun Zhou, Chanjun Sun, Chen Wang, Limei Yin, Xiaobo Zou and Zhiming Guo
Foods 2025, 14(15), 2706; https://doi.org/10.3390/foods14152706 - 1 Aug 2025
Viewed by 304
Abstract
Gas sensors are considered a highly effective non-destructive technique for monitoring the quality and safety of food materials. These intelligent sensors can detect volatile profiles emitted by food products, providing valuable information on the changes occurring within the food. Gas sensors have garnered [...] Read more.
Gas sensors are considered a highly effective non-destructive technique for monitoring the quality and safety of food materials. These intelligent sensors can detect volatile profiles emitted by food products, providing valuable information on the changes occurring within the food. Gas sensors have garnered significant interest for their numerous advantages in the development of food safety monitoring systems. The adaptable characteristics of gas sensors make them ideal for integration into production lines, while the flexibility of certain sensor types allows for incorporation into packaging materials. Various types of gas sensors have been developed for their distinct properties and are utilized in a wide range of applications. Metal-oxide semiconductors and optical sensors are widely studied for their potential use as gas sensors in food quality assessments due to their ability to provide visual indicators to consumers. The advancement of new nanomaterials and their integration with advanced data acquisition techniques is expected to enhance the performance and utility of sensors in sustainable practices within the food supply chain. Full article
(This article belongs to the Section Food Analytical Methods)
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12 pages, 5365 KiB  
Article
A 100 MHz 3 dB Bandwidth, 30 V Rail-to-Rail Class-AB Buffer Amplifier for Base Station ET-PA Hybrid Supply Modulator
by Min-Ju Kim, Donghwi Kang, Gyujin Choi, Seong-Jun Youn and Ji-Seon Paek
Electronics 2025, 14(15), 3036; https://doi.org/10.3390/electronics14153036 - 30 Jul 2025
Viewed by 200
Abstract
This paper presents the first hybrid supply modulator (HSM) designed for envelope tracking power amplifiers (ET-PAs) in base station applications. The focus is on a rail-to-rail Class-AB linear amplifier (LA) optimized for high-voltage and wide-bandwidth operation. The LA is designed using 130 nm [...] Read more.
This paper presents the first hybrid supply modulator (HSM) designed for envelope tracking power amplifiers (ET-PAs) in base station applications. The focus is on a rail-to-rail Class-AB linear amplifier (LA) optimized for high-voltage and wide-bandwidth operation. The LA is designed using 130 nm BCD technology, utilizing Laterally Diffused Metal-Oxide Semiconductor (LDMOS) transistors for high-voltage operation and incorporating shielding MOSFETs to protect the low-voltage devices. The circuit utilizes dual power supply domains (5 V and 30 V) to improve power efficiency. The proposed LA achieves a bandwidth of 100 MHz and a slew rate of +1003/−852 V/μs, with a quiescent power consumption of 0.89 W. Transient simulations using a 50 MHz bandwidth 5G NR envelope input demonstrate that the proposed HSM achieves a power efficiency of 83%. Consequently, the proposed HSM supports high-output (100 W) wideband 5G NR transmission with enhanced efficiency. Full article
(This article belongs to the Special Issue Analog/Mixed Signal Integrated Circuit Design)
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31 pages, 11019 KiB  
Review
A Review of Tunnel Field-Effect Transistors: Materials, Structures, and Applications
by Shupeng Chen, Yourui An, Shulong Wang and Hongxia Liu
Micromachines 2025, 16(8), 881; https://doi.org/10.3390/mi16080881 - 29 Jul 2025
Viewed by 421
Abstract
The development of an integrated circuit faces the challenge of the physical limit of Moore’s Law. One of the most important “Beyond Moore” challenges is the scaling down of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) versus their increasing static power consumption. This is because, at [...] Read more.
The development of an integrated circuit faces the challenge of the physical limit of Moore’s Law. One of the most important “Beyond Moore” challenges is the scaling down of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) versus their increasing static power consumption. This is because, at room temperature, the thermal emission transportation mechanism will cause a physical limitation on subthreshold swing (SS), which is fundamentally limited to a minimum value of 60 mV/decade for MOSFETs, and accompanied by an increase in off-state leakage current with the process of scaling down. Moreover, the impacts of short-channel effects on device performance also become an increasingly severe problem with channel length scaling down. Due to the band-to-band tunneling mechanism, Tunnel Field-Effect Transistors (TFETs) can reach a far lower SS than MOSFETs. Recent research works indicated that TFETs are already becoming some of the promising candidates of conventional MOSFETs for ultra-low-power applications. This paper provides a review of some advances in materials and structures along the evolutionary process of TFETs. An in-depth discussion of both experimental works and simulation works is conducted. Furthermore, the performance of TFETs with different structures and materials is explored in detail as well, covering Si, Ge, III-V compounds and 2D materials, alongside different innovative device structures. Additionally, this work provides an outlook on the prospects of TFETs in future ultra-low-power electronics and biosensor applications. Full article
(This article belongs to the Special Issue MEMS/NEMS Devices and Applications, 3rd Edition)
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22 pages, 10412 KiB  
Article
Design and Evaluation of Radiation-Tolerant 2:1 CMOS Multiplexers in 32 nm Technology Node: Transistor-Level Mitigation Strategies and Performance Trade-Offs
by Ana Flávia D. Reis, Bernardo B. Sandoval, Cristina Meinhardt and Rafael B. Schvittz
Electronics 2025, 14(15), 3010; https://doi.org/10.3390/electronics14153010 - 28 Jul 2025
Viewed by 297
Abstract
In advanced Complementary Metal-Oxide-Semiconductor (CMOS) technologies, where diminished feature sizes amplify radiation-induced soft errors, the optimization of fault-tolerant circuit designs requires detailed transistor-level analysis of reliability–performance trade-offs. As a fundamental building block in digital systems and critical data paths, the 2:1 multiplexer, widely [...] Read more.
In advanced Complementary Metal-Oxide-Semiconductor (CMOS) technologies, where diminished feature sizes amplify radiation-induced soft errors, the optimization of fault-tolerant circuit designs requires detailed transistor-level analysis of reliability–performance trade-offs. As a fundamental building block in digital systems and critical data paths, the 2:1 multiplexer, widely used in data-path routing, clock networks, and reconfigurable systems, provides a critical benchmark for assessing radiation-hardened design methodologies. In this context, this work aims to analyze the power consumption, area overhead, and delay of 2:1 multiplexer designs under transient fault conditions, employing the CMOS and Differential Cascode Voltage Switch Logic (DCVSL) logic styles and mitigation strategies. Electrical simulations were conducted using 32 nm high-performance predictive technology, evaluating both the original circuit versions and modified variants incorporating three mitigation strategies: transistor sizing, D-Cells, and C-Elements. Key metrics, including power consumption, delay, area, and radiation robustness, were analyzed. The C-Element and transistor sizing techniques ensure satisfactory robustness for all the circuits analyzed, with a significant impact on delay, power consumption, and area. Although the D-Cell technique alone provides significant improvements, it is not enough to achieve adequate levels of robustness. Full article
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14 pages, 2878 KiB  
Article
A Peak Current Mode Boost DC-DC Converter with Hybrid Spread Spectrum
by Xing Zhong, Jianhai Yu, Yongkang Shen and Jinghu Li
Micromachines 2025, 16(8), 862; https://doi.org/10.3390/mi16080862 - 26 Jul 2025
Viewed by 288
Abstract
The stable operation of micromachine systems relies on reliable power management, where DC-DC converters provide energy with high efficiency to extend operational endurance. However, these converters also constitute significant electromagnetic interference (EMI) sources that may interfere with the normal functioning of micro-electromechanical systems. [...] Read more.
The stable operation of micromachine systems relies on reliable power management, where DC-DC converters provide energy with high efficiency to extend operational endurance. However, these converters also constitute significant electromagnetic interference (EMI) sources that may interfere with the normal functioning of micro-electromechanical systems. This paper proposes a boost converter utilizing Pulse Width Modulation (PWM) with peak current mode control to address the EMI issues inherent in the switching operation of DC-DC converters. The converter incorporates a Hybrid Spread Spectrum (HSS) technique to effectively mitigate EMI noise. The HSS combines a 1.2 MHz pseudo-random spread spectrum with a 9.4 kHz triangular periodic spread spectrum. At a standard switching frequency of 2 MHz, the spread spectrum range is set to ±7.8%. Simulations conducted using a 0.5 μm Bipolar Complementary Metal-Oxide-Semiconductor Double-diffused Metal-Oxide-Semiconductor (BCD) process demonstrate that the HSS technique reduces EMI around the switching frequency by 12.29 dBμV, while the converter’s efficiency decreases by less than 1%. Full article
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10 pages, 4230 KiB  
Article
Enhanced UVC Responsivity of Heteroepitaxial α-Ga2O3 Photodetector with Ultra-Thin HfO2 Interlayer
by SiSung Yoon, SeungYoon Oh, GyuHyung Lee, YongKi Kim, SunJae Kim, Ji-Hyeon Park, MyungHun Shin, Dae-Woo Jeon and GeonWook Yoo
Micromachines 2025, 16(7), 836; https://doi.org/10.3390/mi16070836 - 21 Jul 2025
Viewed by 569
Abstract
In this study, the influence of HfO2 interlayer thickness on the performance of heteroepitaxial α-Ga2O3 layer-based metal–insulator–semiconductor–insulator–metal (MISIM) ultraviolet photodetectors is examined. A thin HfO2 interlayer enhances the interface quality and reduces the density of interface traps, thereby [...] Read more.
In this study, the influence of HfO2 interlayer thickness on the performance of heteroepitaxial α-Ga2O3 layer-based metal–insulator–semiconductor–insulator–metal (MISIM) ultraviolet photodetectors is examined. A thin HfO2 interlayer enhances the interface quality and reduces the density of interface traps, thereby improving the performance of UVC photodetectors. The fabricated device with a 1 nm HfO2 interlayer exhibited a significantly reduced dark current and higher photocurrent than a conventional metal–semiconductor–metal (MSM). Specifically, the 1 nm HfO2 MISIM device demonstrated a photocurrent of 2.3 μA and a dark current of 6.61 pA at 20 V, whereas the MSM device exhibited a photocurrent of 1.1 μA and a dark current of 73.3 pA. Furthermore, the photodetector performance was comprehensively evaluated in terms of responsivity, response speed, and high-temperature operation. These results suggest that the proposed ultra-thin HfO2 interlayer is an effective strategy for enhancing the performance of α-Ga2O3-based UVC photodetectors by simultaneously suppressing dark currents and increasing photocurrents and ultimately demonstrate its potential for stable operation under extreme environmental conditions. Full article
(This article belongs to the Special Issue Photodetectors and Their Applications)
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15 pages, 2806 KiB  
Article
Ni-MOF/g-C3N4 S-Scheme Heterojunction for Efficient Photocatalytic CO2 Reduction
by Muhammad Sabir, Mahmoud Sayed, Iram Riaz, Guogen Qiu, Muhammad Tahir, Khuloud A. Alibrahim and Wang Wang
Materials 2025, 18(14), 3419; https://doi.org/10.3390/ma18143419 - 21 Jul 2025
Viewed by 498
Abstract
The rapid recombination of photoinduced charge carriers in semiconductors remains a significant challenge for their practical application in photocatalysis. This study presents the design of a step-scheme (S-scheme) heterojunction composed of carbon nitride (g-C3N4) and nickel-based metal–organic framework (Ni-MOF) [...] Read more.
The rapid recombination of photoinduced charge carriers in semiconductors remains a significant challenge for their practical application in photocatalysis. This study presents the design of a step-scheme (S-scheme) heterojunction composed of carbon nitride (g-C3N4) and nickel-based metal–organic framework (Ni-MOF) to achieve enhanced charge separation. The establishment of an S-scheme charge transfer configuration at the interface of the Ni-MOF/g-C3N4 heterostructure plays a pivotal role in enabling efficient charge carrier separation, and hence, high CO2 photoreduction efficiency with a CO evolution rate of 1014.6 µmol g−1 h−1 and selectivity of 95% under simulated solar illumination. CO evolution represents an approximately 3.7-fold enhancement compared to pristine Ni-MOF. Density functional theory (DFT) calculations, supported by in situ irradiated X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance (EPR) experimental results, confirmed the establishment of a well-defined and strongly bonded interface, which improves the charge transfer and separation following the S-scheme mechanism. This study sheds light on MOF-based S-scheme heterojunctions as fruitful and selective alternatives for practical CO2 photoreduction. Full article
(This article belongs to the Section Energy Materials)
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18 pages, 2708 KiB  
Article
Mathematical Model of a Semiconductor Structure Based on Vanadium Dioxide for the Mode of a Conductive Phase
by Oleksii Kachura, Valeriy Kuznetsov, Mykola Tryputen, Vitalii Kuznetsov, Sergei Kolychev, Artur Rojek and Petro Hubskyi
Electronics 2025, 14(14), 2884; https://doi.org/10.3390/electronics14142884 - 18 Jul 2025
Viewed by 237
Abstract
This study presents a comprehensive mathematical model of a semiconductor structure based on vanadium dioxide (VO2), specifically in its conductive phase. The model was developed using the finite element method (FEM), enabling detailed simulation of the formation of a conductive [...] Read more.
This study presents a comprehensive mathematical model of a semiconductor structure based on vanadium dioxide (VO2), specifically in its conductive phase. The model was developed using the finite element method (FEM), enabling detailed simulation of the formation of a conductive channel under the influence of low-frequency alternating voltage (50 Hz). The VO2 structure under investigation exhibits pronounced electric field concentration at the surface, where the field strength reaches approximately 5 × 104 V/m, while maintaining a more uniform distribution of around 2 × 104 V/m within the bulk of the material. The simulation results were validated experimentally using a test circuit. Minor deviations—no greater than 8%—were observed between the simulated and measured current values, attributed to magnetic core saturation and modeling assumptions. A distinctive feature of the model is its ability to incorporate the nonlinear dependencies of VO2’s electrical properties on frequency. Analytical expressions were derived for the magnetic permeability and resistivity of VO2, demonstrating excellent agreement with experimental data. The coefficients of determination (R2) for the frequency dependence of magnetic permeability and resistance were found to be 0.9976 and 0.9999, respectively. The current version of the model focuses exclusively on the conductive phase and does not include the thermally induced metal–insulator phase transition characteristic of VO2. The study confirms that VO2-based structures exhibit high responsiveness and nonlinear switching behavior, making them suitable for applications in electronic surge protection, current limiting, and switching elements. The developed model provides a reliable and physically grounded tool for the design and optimization components based on VO2 in power electronics and protective circuitry. Full article
(This article belongs to the Section Electronic Materials, Devices and Applications)
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15 pages, 4734 KiB  
Article
Research on the Terahertz Modulation Performance of VO2 Thin Films with Surface Plasmon Polaritons Structure
by Tao Chen, Qi Zhang, Jin Wang, Jiran Liang and Weibin Zhou
Coatings 2025, 15(7), 838; https://doi.org/10.3390/coatings15070838 - 17 Jul 2025
Viewed by 312
Abstract
This paper focuses on the switching and modulation techniques of terahertz waves, develops VO2 thin-film materials with an SPP structure, and uses terahertz time-domain spectroscopy (THz-TDS) to study the semiconductor–metal phase transition characteristics of VO2 thin films, especially the photoinduced semiconductor–metal [...] Read more.
This paper focuses on the switching and modulation techniques of terahertz waves, develops VO2 thin-film materials with an SPP structure, and uses terahertz time-domain spectroscopy (THz-TDS) to study the semiconductor–metal phase transition characteristics of VO2 thin films, especially the photoinduced semiconductor–metal phase transition characteristics of silicon-based VO2 thin films. The optical modulation characteristics of silicon-based VO2 thin films to terahertz waves under different light excitation modes, such as continuous light irradiation at different wavelengths and femtosecond pulsed laser irradiation, were analyzed. Combining the optical modulation characteristics of silicon-based VO2 thin films with the filtering characteristics of SPP structures, composite structures of VO2 thin films with metal hole arrays, composite structures of VO2 thin films with metal block arrays, and silicon-based VO2 microstructure arrays were designed. The characteristics of this dual-function device were tested experimentally. The experiment proves that the VO2 film material with an SPP structure has a transmission rate dropping sharply from 32% to 1% under light excitation; the resistivity changes by more than six orders of magnitude, and the modulation effect is remarkable. By applying the SPP structure to the VO2 material, the material can simultaneously possess modulation and filtering functions, enhancing its optical performance in the terahertz band. Full article
(This article belongs to the Section Thin Films)
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13 pages, 2012 KiB  
Article
Electronic Nose System Based on Metal Oxide Semiconductor Sensors for the Analysis of Volatile Organic Compounds in Exhaled Breath for the Discrimination of Liver Cirrhosis Patients and Healthy Controls
by Makhtar War, Benachir Bouchikhi, Omar Zaim, Naoual Lagdali, Fatima Zohra Ajana and Nezha El Bari
Chemosensors 2025, 13(7), 260; https://doi.org/10.3390/chemosensors13070260 - 17 Jul 2025
Viewed by 378
Abstract
The early detection of liver cirrhosis (LC) is crucial due to its high morbidity and mortality in advanced stages. Reliable, non-invasive diagnostic tools are essential for timely intervention. Exhaled human breath, reflecting metabolic changes, offers significant potential for disease diagnosis. This paper focuses [...] Read more.
The early detection of liver cirrhosis (LC) is crucial due to its high morbidity and mortality in advanced stages. Reliable, non-invasive diagnostic tools are essential for timely intervention. Exhaled human breath, reflecting metabolic changes, offers significant potential for disease diagnosis. This paper focuses on the emerging role of sensor array-based volatile organic compounds (VOCs) analysis of exhaled breath, particularly using electronic nose (e-nose) technology to differentiate LC patients from healthy controls (HCs). This study included 55 participants: 27 LC patients and 28 HCs. Sensor’s measurement data were analyzed using machine learning techniques, such as principal component analysis (PCA), discriminant function analysis (DFA), and support vector machines (SVMs) that were utilized to uncover meaningful patterns and facilitate accurate classification of sensor-derived information. The diagnostic accuracy was thoroughly assessed through receiver operating characteristic (ROC) curve analysis, with specific emphasis on assessing sensitivity and specificity metrics. The e-nose effectively distinguished LC from HC, with PCA explaining 92.50% variance and SVMs achieving 100% classification accuracy. This study demonstrates the significant potential of e-nose technology towards VOCs analysis in exhaled breath, as a valuable tool for LC diagnosis. It also explores feature extraction methods and suitable algorithms for effectively distinguishing between LC patients and controls. This research provides a foundation for advancing breath-based diagnostic technologies for early detection and monitoring of liver cirrhosis. Full article
(This article belongs to the Section Analytical Methods, Instrumentation and Miniaturization)
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26 pages, 3771 KiB  
Article
BGIR: A Low-Illumination Remote Sensing Image Restoration Algorithm with ZYNQ-Based Implementation
by Zhihao Guo, Liangliang Zheng and Wei Xu
Sensors 2025, 25(14), 4433; https://doi.org/10.3390/s25144433 - 16 Jul 2025
Viewed by 239
Abstract
When a CMOS (Complementary Metal–Oxide–Semiconductor) imaging system operates at a high frame rate or a high line rate, the exposure time of the imaging system is limited, and the acquired image data will be dark, with a low signal-to-noise ratio and unsatisfactory sharpness. [...] Read more.
When a CMOS (Complementary Metal–Oxide–Semiconductor) imaging system operates at a high frame rate or a high line rate, the exposure time of the imaging system is limited, and the acquired image data will be dark, with a low signal-to-noise ratio and unsatisfactory sharpness. Therefore, in order to improve the visibility and signal-to-noise ratio of remote sensing images based on CMOS imaging systems, this paper proposes a low-light remote sensing image enhancement method and a corresponding ZYNQ (Zynq-7000 All Programmable SoC) design scheme called the BGIR (Bilateral-Guided Image Restoration) algorithm, which uses an improved multi-scale Retinex algorithm in the HSV (hue–saturation–value) color space. First, the RGB image is used to separate the original image’s H, S, and V components. Then, the V component is processed using the improved algorithm based on bilateral filtering. The image is then adjusted using the gamma correction algorithm to make preliminary adjustments to the brightness and contrast of the whole image, and the S component is processed using segmented linear enhancement to obtain the base layer. The algorithm is also deployed to ZYNQ using ARM + FPGA software synergy, reasonably allocating each algorithm module and accelerating the algorithm by using a lookup table and constructing a pipeline. The experimental results show that the proposed method improves processing speed by nearly 30 times while maintaining the recovery effect, which has the advantages of fast processing speed, miniaturization, embeddability, and portability. Following the end-to-end deployment, the processing speeds for resolutions of 640 × 480 and 1280 × 720 are shown to reach 80 fps and 30 fps, respectively, thereby satisfying the performance requirements of the imaging system. Full article
(This article belongs to the Section Remote Sensors)
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