Single-Event Effects: Modeling, Prediction, Testing and Radiation Hardening

Dear Colleagues,

Single-event effects (SEEs), caused by high-energy particles, pose significant challenges to the reliability and safety of electronic systems in both space and terrestrial environments. Traditionally, research in SEEs has focused on soft errors such as single-event upsets (SEUs), single-event transients (SETs), and single-event functional interrupts (SEFIs). However, with the scaling of semiconductor technologies, the use of wide-bandgap semiconductors, and the increasing complexity of applications—from space exploration to autonomous cars—other critical effects, such as single-event latch-up (SEL), single-event burnout (SEB), single-event gate rupture (SEGR), and single-event leakage current (SELC), are becoming equally significant and require novel approaches in modeling, prediction, testing, and mitigation.

This Special Issue aims to gather high-quality submissions that address both fundamental and advanced topics in SEE research, with a focus on comprehensive methodologies for modeling, prediction, testing, and hardening. SEEs will be explored across a wide range of applications and technology platforms, from traditional space systems to emerging ground-level environments, like autonomous vehicles, high-performance computing, medical devices, and particle accelerators. Additionally, this Special Issue will highlight new approaches in alternative SEE testing methodologies—using tools like lasers and high-energy heavy ions—and discuss the challenges in the radiation monitoring and dosimetry needs involved in ensuring accurate SEE characterization and rate prediction. The topics of interest include, but are not limited to, the following:

• Modeling and prediction of single-event effects:
  • Mechanisms of soft errors (SEUs, SETs, and SEFIs);
  • Mechanisms of destructive effects (SEL, SEB, SEGR, and SELC);
  • Simulation and prediction tools.
• Experimental characterization of single-event effects in the following:
  • Advanced technologies (FinFETs, GAA, etc.);
  • Mixed-signal, RF, power, and digital circuits (such as radar circuits, RISC-V processors, and custom SoC designs).
• Testing methodologies:
  • Alternative SEE testing methods, such as laser testing, mixed-field, and high-energy heavy-ion irradiation;
  • Innovations in SEE test facilities, including the calibration of ion beams and the related radiation monitoring as well as dosimetry.
• Radiation-hardening-by-design (RHBD) techniques:
  • Novel layout-level hardening techniques;
  • Novel circuit-level hardening techniques;
  • Novel system-level hardening techniques;
  • Design automation tools for integrating radiation-hardened techniques into advanced ICs and system-on-chip designs.
• Radiation-hardening-by-process (RHBP) techniques:
  • Innovations in device-level hardening by using materials and novel architectures that exhibit natural SEE resilience.
• Single-event effects in disruptive technologies like quantum computing, silicon photonics, and AI-driven applications.

Dr. Ygor Aguiar
Dr. Corinna Martinella
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• single-event effects
• soft errors
• SEE modeling and prediction
• wide-bandgap semiconductors
• radiation testing
• hardening techniques