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Keywords = cascode structure

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20 pages, 3678 KB  
Article
A Low-Noise, Low-Power, and Wide-Bandwidth Regulated Cascode Transimpedance Amplifier with Cascode-Feedback in 40 nm CMOS
by Xiangyi Zhang, Yuansheng Zhao, Guoyi Yu, Zhenghao Lu and Chao Wang
Sensors 2026, 26(2), 465; https://doi.org/10.3390/s26020465 - 10 Jan 2026
Viewed by 372
Abstract
The dramatic growth in the emerging optical applications, including Lidar, short-range optical communication, and optical integrated sensing and communication (ISAC) calls for high-bandwidth transimpedance amplifiers (TIA) with low noise and low power in advanced CMOS technology nodes. To address the issues of existing [...] Read more.
The dramatic growth in the emerging optical applications, including Lidar, short-range optical communication, and optical integrated sensing and communication (ISAC) calls for high-bandwidth transimpedance amplifiers (TIA) with low noise and low power in advanced CMOS technology nodes. To address the issues of existing TIA design, including the conventional RGC structure and the dual-feedback regulated cascode (RGC) TIA, design with complex feedback paths, i.e., limited bandwidth, extra noise, and high power consumption for enough bandwidth, this paper presents a novel TIA with the following key contributions. A novel RGC structure with cascode-feedback is proposed to increase feedback gain, thereby extending bandwidth and reducing noise. Design strategy of the proposed RGC TIA in a low-power advanced CMOS process is carried out to exploit weak inversion operation to achieve better power efficiency. Frequency response and noise analysis are also conducted to achieve target bandwidth and noise performance. The proposed TIA is designed and simulated in 40 nm CMOS with a target PD capacitance of 0.15 pF, achieving a −3 dB bandwidth of 9.2 GHz and a transimpedance gain of 71 dBΩ. The average input-referred noise current spectral density is 18.3 pA/Hz. Operating at 1.2 V, the core circuits consume only 6.6 mW, excluding the output buffer. Compared with prior RGC TIA designs, the proposed TIA achieves a 7.4×~243× enhancement in figure of merit. Full article
(This article belongs to the Section Optical Sensors)
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11 pages, 3116 KB  
Article
A Fully Integrated Direct Conversion Transmitter with I/Q-Isolated CMOS PA for Sub-6 GHz 5G NR
by Donghwi Kang, Jeheon Lee, Hyeong-Ju Kwon, So-Min Park, Soo-Jin Park, Sung-Uk We and Ji-Seon Paek
Electronics 2026, 15(1), 64; https://doi.org/10.3390/electronics15010064 - 23 Dec 2025
Viewed by 253
Abstract
This work presents a direct conversion transmitter (DCT) for 5G new radio (NR) that eliminates the RF driver by directly feeding a single stage cascode PA through a baseband buffer amplifier and passive up-conversion mixer. The baseband interface uses Class-AB buffers to hold [...] Read more.
This work presents a direct conversion transmitter (DCT) for 5G new radio (NR) that eliminates the RF driver by directly feeding a single stage cascode PA through a baseband buffer amplifier and passive up-conversion mixer. The baseband interface uses Class-AB buffers to hold the output capacitor voltage, enabling accurate sampling at the PA input. A mixer switch is selected for minimal on-resistance variation over the required baseband swing. The PA is designed with separate I and Q voltage inputs and a current summing structure. The PA operates at 2.5 V; other blocks use 1.2 V. Post-layout two-tone simulations at 5 GHz indicate 21 dBm output saturation power and −36.1 dBc of IMD3 at 9 dB PBO power while removing the driver to inter stage matching network of a two-stage design. The results validate a compact, driverless architecture for integrated transmitters. Full article
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13 pages, 2287 KB  
Article
Damage Mechanism Analysis of High Field Stress on Cascode GaN HEMT Power Devices
by Shuo Su, Yanrong Cao, Weiwei Zhang, Xinxiang Zhang, Chuan Chen, Linshan Wu, Zhixian Zhang, Miaofen Li, Ling Lv, Xuefeng Zheng, Wenchao Tian, Xiaohua Ma and Yue Hao
Micromachines 2025, 16(7), 729; https://doi.org/10.3390/mi16070729 - 22 Jun 2025
Viewed by 3162
Abstract
A series of problems, such as material damage and charge trap, can be caused when GaN HEMT power devices are subjected to high field stress in the off-state. The reliability of GaN HEMT power devices affects the safe operation of the entire power [...] Read more.
A series of problems, such as material damage and charge trap, can be caused when GaN HEMT power devices are subjected to high field stress in the off-state. The reliability of GaN HEMT power devices affects the safe operation of the entire power electronic system and seriously threatens the stability of the equipment. Therefore, it is particularly important to study the damage mechanism of GaN HEMT power devices under high field conditions. This work studies the degradation of Cascode GaN HEMT power devices under off-state high-field stress and analyzes the related damage mechanism. It is found that the high field stress in the off-state will generate a positive charge trap in the oxide layer of the MOS device in the cascade structure. Moreover, defects occur in the barrier layer and buffer layer of GaN HEMT devices, and the threshold voltage of Cascode GaN HEMT power devices is negatively shifted, and the transconductance is reduced. This study provides an important theoretical basis for the reliability of GaN HEMT power devices in complex and harsh environments. Full article
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16 pages, 6306 KB  
Article
Design and Realization of a High-Q Grounded Tunable Active Inductor for 5G NR (FR1) Transceiver Front-End Applications
by Sehmi Saad, Aymen Ben Hammadi and Fayrouz Haddad
Sensors 2025, 25(10), 3070; https://doi.org/10.3390/s25103070 - 13 May 2025
Cited by 2 | Viewed by 1107
Abstract
This paper presents a wide-tuning-range, low-power tunable active inductor (AI) designed and fabricated using 130 nm CMOS technology with six metal layers. To achieve high performance with a relatively small silicon area and low power consumption, the AI structure is carefully designed and [...] Read more.
This paper presents a wide-tuning-range, low-power tunable active inductor (AI) designed and fabricated using 130 nm CMOS technology with six metal layers. To achieve high performance with a relatively small silicon area and low power consumption, the AI structure is carefully designed and optimized using a cascode stage, a feedback resistor, and multi-gate finger transistors. In the proposed circuit topology, inductance tuning is realized by adjusting both the bias current and the feedback resistor. The performance of the circuit is evaluated in terms of tuning range, quality factor, power consumption, and chip area. The functionality of the fabricated device is experimentally validated, and the fundamental characteristics of the active inductor are measured over a wide frequency range using a Cascade GSG probe, with results compared to simulations. Experimental measurements show that, under a 1 V supply, the AI achieves a self-resonant frequency (SRF) of 3.961 GHz and a quality factor (Q) exceeding 1586 at 2.383 GHz. The inductance is tunable between 6.7 nH and 84.4 nH, with a total power consumption of approximately 2 mW. The total active area, including pads, is 345 × 400 µm2. Full article
(This article belongs to the Special Issue Feature Papers in Electronic Sensors 2025)
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16 pages, 1333 KB  
Article
Designing and Optimizing a 2.4 GHz Complementary Metal–Oxide-Semiconductor Class-E Power Amplifier Combining Standard and High-Voltage Metal–Oxide-Semiconductor Field-Effect Transistors
by Roberto Cancelli, Gianfranco Avitabile and Antonello Florio
Electronics 2025, 14(6), 1135; https://doi.org/10.3390/electronics14061135 - 13 Mar 2025
Cited by 4 | Viewed by 1096
Abstract
The advent of CMOS power amplifiers has enabled compact and cost-effective solutions for RF applications. Among the available options, switching amplifiers are the most competitive due to their superior efficiency. In this paper, we present the design of a fully integrated 130 nm [...] Read more.
The advent of CMOS power amplifiers has enabled compact and cost-effective solutions for RF applications. Among the available options, switching amplifiers are the most competitive due to their superior efficiency. In this paper, we present the design of a fully integrated 130 nm CMOS class-E RF power amplifier optimized for 2.4 GHz ISM band operations that is compliant with the Bluetooth Low Energy (BLE) standard. The amplifier is based on a cascode configuration with charging acceleration capacitance and a combination of standard and high-voltage (HV) MOSFETs, ensuring optimal performance while maintaining device reliability. To identify the best configuration for the proposed circuit, we first provide an overview of basic class-E amplifier operations and critically review optimization techniques proposed in the scientific literature. This review is complemented by a numerical analysis of the potential advantages of using a combined standard-HV MOSFET structure. Post-layout simulations with parasitic parameter extraction demonstrated that the amplifier achieves 40.85% Power Added Efficiency and 20.52 dBm output power. Full article
(This article belongs to the Section Circuit and Signal Processing)
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11 pages, 4417 KB  
Communication
Design of a High-Gain Multi-Input LNA with 16.4 Degree Phase Shift Within the 32 dB Gain Range
by Dong-Min Kim, Kyung-Duk Choi, Sung-Hwan Paik, Kyung-Jin Lee, Jun-Eun Park, Sang-Sun Yoo, Keum-Cheol Hwang, Youn-goo Yang and Kang-Yoon Lee
Sensors 2025, 25(6), 1708; https://doi.org/10.3390/s25061708 - 10 Mar 2025
Viewed by 1268
Abstract
This paper presents a high-gain multi-input low-noise amplifier (LNA) design aimed at achieving stable phase and minimal noise within a flexible gain range for modern wireless communication systems. The proposed LNA, designed using a CASCODE architecture and implemented in a 65 nm silicon-on-insulator [...] Read more.
This paper presents a high-gain multi-input low-noise amplifier (LNA) design aimed at achieving stable phase and minimal noise within a flexible gain range for modern wireless communication systems. The proposed LNA, designed using a CASCODE architecture and implemented in a 65 nm silicon-on-insulator (SOI) process, demonstrates significant improvements in isolation, noise reduction, and miniaturization. The SOI process reduces parasitic capacitance, enhancing performance and thermal/electrical isolation, critical for high-frequency applications. The CASCODE structure minimizes unwanted coupling between stages, enhancing signal integrity and maintaining stable operation across multiple gain modes. The LNA operates in the 2.3 GHz to 2.69 GHz frequency band and supports seven gain modes. It achieves a maximum gain of 21.45 dB with a noise figure of 1.03 dB at the highest gain mode. Notably, it maintains phase stability within 16.4 degrees across the entire gain range, ensuring consistent phase alignment, which is crucial for applications requiring precise signal alignment. The design eliminates the need for switching mechanisms typically used in conventional LNAs, which often introduce additional noise. This work demonstrates that the CASCODE-based multi-input LNA, implemented in a 65 nm SOI process, successfully meets the rigorous demands of high-frequency communication systems, achieving an optimal balance between gain flexibility, noise reduction, and stable phase control within a 32 dB gain range. Full article
(This article belongs to the Section Electronic Sensors)
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17 pages, 5815 KB  
Article
A 250 °C Low-Power, Low-Temperature-Drift Offset Chopper-Stabilized Operational Amplifier with an SC Notch Filter for High-Temperature Applications
by Zhong Yang, Jiaqi Li, Jiangduo Fu, Jiayin Song, Qingsong Cai and Shushan Qiao
Appl. Sci. 2025, 15(2), 849; https://doi.org/10.3390/app15020849 - 16 Jan 2025
Cited by 1 | Viewed by 2244
Abstract
This paper proposes a three-stage op amp based on the SOI (silicon-on-insulator) process, which achieves a low offset voltage and temperature coefficient across a wide temperature range from −40 °C to 250 °C. It can be used in aerospace, oil and gas exploration, [...] Read more.
This paper proposes a three-stage op amp based on the SOI (silicon-on-insulator) process, which achieves a low offset voltage and temperature coefficient across a wide temperature range from −40 °C to 250 °C. It can be used in aerospace, oil and gas exploration, automotive electronics, nuclear industry, and in other fields where the ability of electronic devices to withstand high-temperature environments is strongly required. By utilizing a SC (Switched Capacitor) notch filter, the op amp achieves low input offset in a power-efficient manner. The circuit features a multi-path nested Miller compensation structure, consisting of a low-speed channel and a high-speed channel, which switch according to the input signal frequency. The input-stage operational amplifier is a fully differential, rail-to-rail design, utilizing tail current control to reduce the impact of common-mode voltage on the transconductance of the input stage. The two-stage operational amplifier uses both cascode and Miller compensation, minimizing the influence of the feedforward signal path and improving the amplifier’s response speed. The prototype op amp is fabricated in a 0.15 µm SOI process and draws 0.3 mA from a 5 V supply. The circuit occupies a chip area of 0.76 mm2. The measured open-loop gain exceeds 140 dB, with a 3 dB bandwidth greater than 100 kHz. The amplifier demonstrates stable performance across a wide temperature range from −40 °C to 250 °C, and exhibits an excellent input offset of approximately 20 µV at room temperature and an offset voltage temperature coefficient of 0.7 μV/°C in the full temperature range. Full article
(This article belongs to the Special Issue Advanced Research on Integrated Circuits and Systems)
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21 pages, 22924 KB  
Article
A Piezoresistive-Sensor Nonlinearity Correction on-Chip Method with Highly Robust Class-AB Driving Capability
by Kai Jing, Yuhang Han, Shaoxiong Yuan, Rong Zhao and Jiabo Cao
Sensors 2024, 24(19), 6395; https://doi.org/10.3390/s24196395 - 2 Oct 2024
Cited by 1 | Viewed by 1832
Abstract
This paper presents a thorough robust Class-AB power amplifier design and its application in pressure-mode sensor-on-chip nonlinearity correction. Considering its use in piezoresistive sensing applications, a gain-boosting-aided folded cascode structure is utilized to increase the amplifier’s gain by a large amount as well [...] Read more.
This paper presents a thorough robust Class-AB power amplifier design and its application in pressure-mode sensor-on-chip nonlinearity correction. Considering its use in piezoresistive sensing applications, a gain-boosting-aided folded cascode structure is utilized to increase the amplifier’s gain by a large amount as well as enhancing the power rejection ability, and a push–pull structure with miller compensation, a floating gate technique, and an adaptive output driving limiting structures are adopted to achieve high-efficiency current driving capability, high stability, and electronic environmental compatibility. This amplifier is applied in a real sensor nonlinearity correction on-chip system. With the help of a self-designed 7-bit + sign DAC and a self-designed two-stage operational amplifier, this system is compatible with nonlinear correction at different signal conditioning output values. It can also drive resistive sensors as small as 300 ohms and as high as tens of thousands of ohms. The designed two-stage operational amplifier utilizes the TSMC 0.18 um process, resulting in a final circuit power consumption of 0.183 mW. The amplifier exhibits a gain greater than 140 dB, a phase margin of 68°, and a unit gain bandwidth exceeding 199.76 kHz. The output voltage range spans from 0 to 4.6 V. The final simulation results indicate that the nonlinear correction system designed in this paper can correct piezoresistive sensors with a nonlinearity of up to ±2.5% under various PVT (Process–Voltage–Temperature) conditions. After calibration by this system, the maximum error in the output voltage is 4 mV, effectively reducing the nonlinearity to 4% of its original value in the worst-case scenario. Full article
(This article belongs to the Section Physical Sensors)
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12 pages, 2049 KB  
Article
An 88 dB SNDR 100 kHz BW Sturdy MASH Delta-Sigma Modulator Using Self-Cascoded Floating Inverter Amplifiers
by Xirui Hao, Yidong Yuan, Jie Pan, Zhaonan Lu, Shuang Song, Xiaopeng Yu and Menglian Zhao
Electronics 2024, 13(19), 3865; https://doi.org/10.3390/electronics13193865 - 29 Sep 2024
Cited by 1 | Viewed by 2160
Abstract
Battery-powered Internet-of-Things applications require high-resolution, energy-efficient analog-to-digital converters (ADCs). There are still limited works on sub-MHz-bandwidth ADC designs. This paper presents a sturdy multi-stage shaping (SMASH) discrete-time (DT) delta-sigma modulator (DSM) structure using a self-cascoded floating-inverter-based dynamic amplifier (FIA). The proposed structure removes [...] Read more.
Battery-powered Internet-of-Things applications require high-resolution, energy-efficient analog-to-digital converters (ADCs). There are still limited works on sub-MHz-bandwidth ADC designs. This paper presents a sturdy multi-stage shaping (SMASH) discrete-time (DT) delta-sigma modulator (DSM) structure using a self-cascoded floating-inverter-based dynamic amplifier (FIA). The proposed structure removes the explicit quantization error extraction of the first loop and all the feedback DACs in the cascaded loop, decreasing the design complexity of the circuit. This enables the proposed DT DSM to operate at a higher speed, which is suitable for achieving high-order noise at a low oversampling ratio (OSR). The proposed self-cascoded FIA is more power-efficient and can acquire more than 45 dB DC gain under a 1.2 V supply. The DT DSM implemented in a piece of 55 nm CMOS technology measures an 88.0 dB peak signal-to-noise-and-distortion ratio (SNDR) in a 100 kHz bandwidth (BW) and an 85.3 dB dynamic range (DR), consuming 249.1 μW from a 1.2 V supply at 10 MS/s. The obtained 174.0 dB SNDR-based Schreier figure-of-merit (FoMs) is competitive within state-of-art high-resolution (SNDR > 85 dB) and general-purpose (sub-MHz-bandwidth) ΔΣ ADCs. Full article
(This article belongs to the Special Issue Analog and Mixed Circuit: Design and Applications)
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12 pages, 3128 KB  
Article
A Pseudo-Differential LNA with Noise Improvement Techniques for Concurrent Multi-Band GNSS Applications
by Minoo Eghtesadi, Mohammad Reza Mosavi and Egidio Ragonese
Electronics 2024, 13(14), 2805; https://doi.org/10.3390/electronics13142805 - 17 Jul 2024
Cited by 2 | Viewed by 1855
Abstract
A low-noise amplifier (LNA) design with the operation of concurrent dual-band for Global Navigation Satellite System (GNSS) receivers with single channel is presented in this work. This LNA structure has an inductively degenerated cascode architecture and is pseudo-differential, operating at two frequencies simultaneously [...] Read more.
A low-noise amplifier (LNA) design with the operation of concurrent dual-band for Global Navigation Satellite System (GNSS) receivers with single channel is presented in this work. This LNA structure has an inductively degenerated cascode architecture and is pseudo-differential, operating at two frequencies simultaneously (1.2 GHz and 1.57 GHz). Two noise reduction/cancellation techniques, using load capacitor and feedforward path, respectively, are proposed resulting in an excellent improvement in the noise figure (NF). The input matching circuit uses both series and parallel resonant components to enable concurrency. The adopted pseudo-differential structure results in input balun elimination. Inductively degenerated cascode topology provides both input impedance and optimum noise impedance matching. The soundness of the proposed approach has been demonstrated in a 0.18-µm CMOS technology by TSMC. Simulation results show that at 1.2 GHz and 1.57 GHz the LNA achieves −13 dB and −11 dB of input matching, 24.6 dB and 24.7 dB of gain, 1.47 dB and 1.43 dB of NF, respectively. The input-referred 1-dB compression point (IP1dB) is around −16 dBm, while the input-referred third-order intercept point (IIP3) achieves −2.2 dBm at 1.2 GHz and −0.6 dBm at 1.57 GHz. The LNA draws about 13 mA from a 1.8-V supply voltage. Full article
(This article belongs to the Section Circuit and Signal Processing)
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15 pages, 8399 KB  
Article
A Low Mismatch Current Charge Pump Applied to Phase-Locked Loops
by Min Guo, Lixin Wang, Shixin Wang, Jiacheng Lu and Mengyao Cui
Micromachines 2024, 15(7), 913; https://doi.org/10.3390/mi15070913 - 14 Jul 2024
Cited by 4 | Viewed by 5041
Abstract
This paper presents a charge pump circuit with a wide output range and low current mismatch applied to phase-locked loops. In this designed structure, T-shaped analog switches are adopted to suppress the non-ideal effects of clock feedthrough, switching time mismatch, and charge injection. [...] Read more.
This paper presents a charge pump circuit with a wide output range and low current mismatch applied to phase-locked loops. In this designed structure, T-shaped analog switches are adopted to suppress the non-ideal effects of clock feedthrough, switching time mismatch, and charge injection. A source follower and current splitting circuits are proposed to improve the matching accuracy of the charging and discharging currents and reduce the current mismatch rate. A rail-to-rail high-gain amplifier with a negative feedback connection is introduced to suppress the charge-sharing effect of the charge pump. A cascode current mirror with a high output impedance is used to provide the charge and discharge currents for the charge pump, which not only improves the current accuracy of the charge pump but also increases the output voltage range. The proposed charge pump is designed and simulated based on a 65 nm CMOS process. The results show that when the power supply voltage is 1.2 V, the output current of the charge pump is 100 μA, the output voltage is in the range of 0.2~1 V, and the maximum current mismatch rate and current variation rate are only 0.21% and 1.4%, respectively. Full article
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14 pages, 636 KB  
Article
A Capacitive-Feedback Amplifier with 0.1% THD and 1.18 μVrms Noise for ECG Recording
by Xi Chen, Taishan Mo, Peng Wu and Bin Wu
Electronics 2024, 13(2), 378; https://doi.org/10.3390/electronics13020378 - 17 Jan 2024
Cited by 3 | Viewed by 3403
Abstract
This paper presents an amplifier with low noise, high gain, low power consumption, and high linearity for electrocardiogram (ECG) recording. The core of this design is a chopper-stabilized capacitive-feedback operational transconductance amplifier (OTA). The proposed OTA has a two-stage structure, with the first [...] Read more.
This paper presents an amplifier with low noise, high gain, low power consumption, and high linearity for electrocardiogram (ECG) recording. The core of this design is a chopper-stabilized capacitive-feedback operational transconductance amplifier (OTA). The proposed OTA has a two-stage structure, with the first stage using a combination of current reuse and cascode techniques to obtain a large gain at low power and the second stage operating in Class A state for better linearity. The amplifier additionally uses a DC servo loop (DSL) to improve the rejection of DC offsets. The amplifier is implemented in a standard 0.13 μm CMOS process, consuming 1.647 μA current from the supply voltage of 1.5 V and occupying an area of 0.97 mm2. The amplifier has a 0.5 Hz to 6.1 kHz bandwidth and 59.7 dB gain while having no less than a 65 dB common-mode rejection ratio (CMRR). The amplifier’s total harmonic distortion (THD) is less than 0.1% at 800 mVpp output. The amplifier can provide a noise level of 1.18 μVrms in the 0.5 Hz to 500 Hz bandwidth that the ECG signal is interested in and has 3.38 μVrms input-referred noise (IRN) over the entire bandwidth, so its noise efficiency factor (NEF) is 2.13. Full article
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14 pages, 1891 KB  
Communication
A 55 nm CMOS RF Transmitter Front-End with an Active Mixer and a Class-E Power Amplifier for 433 MHz ISM Band Applications
by Huazhong Yuan, Ranran Zhou, Peng Wang, Hui Xu and Yong Wang
Electronics 2023, 12(22), 4711; https://doi.org/10.3390/electronics12224711 - 20 Nov 2023
Cited by 2 | Viewed by 2658
Abstract
In order to meet the increasing demands of wireless communication for ISM bands, a 433 MHz transmitter RF front-end is designed using a 55 nm low-power CMOS technology. The circuits consist of an active mixer, a driver amplifier and a class-E power amplifier [...] Read more.
In order to meet the increasing demands of wireless communication for ISM bands, a 433 MHz transmitter RF front-end is designed using a 55 nm low-power CMOS technology. The circuits consist of an active mixer, a driver amplifier and a class-E power amplifier (PA). A double-balanced Gilbert active mixer is designed to realize binary phase-shift keying (BPSK) modulation. The driver is used to preamplify the modulated RF signals. The class-E PA adopts a parallel four-branch cascode structure to control the output power level. The load network of the PA is implemented through an off-chip circuit, in which a finite DC-feed inductance load network is selected to reduce the power loss. The mixer and driver are designed with a 1.2 V supply voltage, while the PA is operated at a 1.8 V supply voltage. The area of the chip is 0.206 mm × 0.089 mm, and the measured results show that it achieves a maximum output power of 2.7 dBm, with a total power consumption of 6.72 mW. At a drain efficiency (DE) of 34.5%, an S22 less than −10 dB over the frequency ranges from 393.79 MHz to 455.70 MHz can be measured for the PA. With 192 kbps BPSK data modulated at 433 MHz, the measured EVM is about 0.83% rms. Full article
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15 pages, 13171 KB  
Article
A Direct Feedback FVF LDO for High Precision FMCW Radar Sensors in 65-nm CMOS Technology
by Jun-Hee Lee, Mun-Kyo Lee and Jung-Dong Park
Sensors 2022, 22(24), 9672; https://doi.org/10.3390/s22249672 - 10 Dec 2022
Cited by 1 | Viewed by 4354
Abstract
A direct feedback flipped voltage follower (FVF) LDO for a high-precision frequency-modulated continuous-wave (FMCW) radar is presented. To minimize the effect of the power supply ripple on the FMCW radar sensor’s resolution, a folded cascode error amplifier (EA) was connected to the outer [...] Read more.
A direct feedback flipped voltage follower (FVF) LDO for a high-precision frequency-modulated continuous-wave (FMCW) radar is presented. To minimize the effect of the power supply ripple on the FMCW radar sensor’s resolution, a folded cascode error amplifier (EA) was connected to the outer loop of the FVF to increase the open-loop gain. The direct feedback structure enhances the PSRR while minimizing the power supply ripple path and not compromising a transient response. The flipped voltage follower with a super source follower forms a fast feedback loop. The stability and parameter variation sensitivity of the multi-loop FVF LDO were analyzed through the state matrix decomposition. We implemented the FVF LDO in TSMC 65 nm CMOS technology. The fabricated FVF LDO supplied a maximum load current of 20 mA with a 1.2 V power supply. The proposed FVF LDO achieved a full-spectrum PSR with a low-frequency PSRR of 66 dB, unity-gain bandwidth of 469 MHz, and 20 ns transient settling time with a load current step from 1 mA to 20 mA. Full article
(This article belongs to the Special Issue Advanced CMOS Integrated Circuit Design and Application II)
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15 pages, 8466 KB  
Article
A Wideband and Low-Power Distributed Cascode Mixer Using Inductive Feedback
by Jihoon Kim
Sensors 2022, 22(22), 9022; https://doi.org/10.3390/s22229022 - 21 Nov 2022
Cited by 5 | Viewed by 3210
Abstract
A wideband and low-power distributed cascode mixer is implemented for future mobile communications. The distributed design inspired by the distributed amplifier (DA) enables a mixer to operate in a wide band. In addition, the cascode structure and inductive positive feedback design allow high [...] Read more.
A wideband and low-power distributed cascode mixer is implemented for future mobile communications. The distributed design inspired by the distributed amplifier (DA) enables a mixer to operate in a wide band. In addition, the cascode structure and inductive positive feedback design allow high conversion gain with low-power consumption. The proposed mixer is fabricated using a 130 nm commercial complementary metal-oxide-semiconductor (CMOS) process. It consists of three cascode gain cells and operates with a drain voltage of 1.5 V and a gate voltage of 0.5 to 0.7 V. The fabricated mixer exhibits conversion gain of −2.9 to 3.1 dB at the radio frequencies (RFs) of 4 to 30 GHz and −1.9 to 0.4 dB at RFs of 54 to 66 GHz under the conditions of 8 to 10 dBm of local oscillator (LO) power and 650 MHz of intermediate frequency (IF). The LO-RF isolation is more than 15 dB over the entire measurement band (0.2 to 67 GHz) as the RF and LO signals are applied to different transistors owing to the cascode structure. The total power consumption is only within 12 mW, and the chip size is 0.056 mm2, making it possible to implement a compact mixer. The proposed mixer shows broadband characteristics covering from ultra-wideband (UWB) and the 28 GHz fifth-generation (5G) communication band to the 60 GHz wireless gigabit alliance (WiGig) band. Full article
(This article belongs to the Special Issue Integrated Circuits for Sensor Systems)
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