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Polymers
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Current Research on Dielectric Properties of Polymer Composites
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Current Research on Dielectric Properties of Polymer Composites

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: closed (30 September 2023) | Viewed by 8913

Special Issue Editor

Dr. Sheng Chen

E-Mail Website
Guest Editor
Key Laboratory of Polymeric Materials and Application Technology of Hunan Province, College of Chemistry, Xiangtan University, Xiangtan 411105, China
Interests: dielectric properties, energy storage of ceramic-polymer dielectric nanocomposite; all-organic dielectric polymers; liquid crystalline polymers design and synthesis

Special Issue Information

Dear Colleagues,

Polymers film capacitors have been widely used in advanced electronics and electric power systems owing to their light weight, mechanical flexibility, ultra-high power density, and fast charge-discharge speed. However, the application of commercial polymer dielectric capacitors in the field of microelectronic devices and harsh environments is limited by their low discharge energy density and low operating temperature. Therefore, in order to satisfy market requirements, it is an urgent need to explore high-performance polymer dielectrics with high discharge energy density and high-temperature resistance.

Today, there are many strategies to improve the permittivity, breakdown strength, and high-temperature resistance of polymers’ dielectrics, especially in developing polymer–matrix dielectric composites. Nevertheless, there are still numerous unclear issues and/or technological problems to be researched, such as the mechanism of polarization and breakdown at low and high temperatures, the relationship between filler structure and properties of polymer dielectrics, the preparation technology of thin-film, large-scale production of polymer dielectrics, and so on.

This Special Issue of Polymers aims to report full research papers, communications, and review articles based on the latest advances in the field of “Current Research on Dielectric Properties of Polymer Composites”. Potential topics include but are not limited to the following:

  • High-temperature polymer dielectric composites;
  • Calculation and simulation of dielectric and breakdown properties;
  • Composition, structure, and properties;
  • Layers structured polymer dielectric composites;
  • Interfacial properties;
  • Fabrication and characterization methods of dielectric composites.

Dr. Sheng Chen
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (5 papers)

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Research

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14 pages, 2508 KiB  
Article
Enhanced DC Dielectric Properties of Crosslinked Polyethylene Comprehensively Modified by the Grafting of a Multifunctional Voltage Stabilizer
by Peng Li, Xuan Wang, Jin Jin, Xiangxiang Sun, Hui Zhang and Runsheng Zhang
Polymers 2024, 16(1), 119; https://doi.org/10.3390/polym16010119 - 29 Dec 2023
Cited by 1 | Viewed by 979
Abstract
In this paper, a new multifunctional compound, 1,1′-(oxalylbis(4,1-phenylene))bis(1H-pyrrole-2,5-dione) (BVM), is grafted onto crosslinked polyethylene (XLPE) by radical-initiated grafting to play triple roles as a voltage stabilizer, space-charge inhibitor and crosslinking auxiliary and to achieve the purpose of comprehensively enhancing the DC dielectric properties [...] Read more.
In this paper, a new multifunctional compound, 1,1′-(oxalylbis(4,1-phenylene))bis(1H-pyrrole-2,5-dione) (BVM), is grafted onto crosslinked polyethylene (XLPE) by radical-initiated grafting to play triple roles as a voltage stabilizer, space-charge inhibitor and crosslinking auxiliary and to achieve the purpose of comprehensively enhancing the DC dielectric properties of polymers while decreasing the type and number of additives. By analyzing the DC breakdown field strength, current density and space-charge distribution of the materials at different temperatures, it is demonstrated that BVM grafting can comprehensively and effectively enhance the electrical properties of the materials, with little dependence on temperature. The BVM molecule has two polar groups and an effective molecular structure that acts as a voltage stabilizer, thus enabling the introduction of dense, uniform, deeply trapped energy levels within the material to inhibit the space charge and to capture high-energy electrons to prevent damage to the material structure; however, the two functions do not affect each other. This is also consistent with first-principles calculations and quantum-chemical calculations. Gel content testing shows no effect on polymer crosslinking, even with a 27.8% reduction in the amount of the crosslinking agent di-isopropyl peroxide (DCP), which reduces the damage to the polymer’s electrical resistance caused by the byproducts of DCP decomposition. Therefore, grafting multifunctional BVM compounds to improve the dielectric characteristics of polymers is a viable area of study in the development of high-voltage direct current (HVDC) cable materials. Full article
(This article belongs to the Special Issue Current Research on Dielectric Properties of Polymer Composites)
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18 pages, 19312 KiB  
Article
Numerical Simulation Research on Partial Discharge of Particle Defects at Epoxy Interface Excited by High-Frequency Sinusoidal Voltage
by Chen Chen, Jian Wang, Jingrui Wang, Zhihui Li, Rui Guo, Hu Jin and Botao Li
Polymers 2023, 15(10), 2320; https://doi.org/10.3390/polym15102320 - 16 May 2023
Cited by 1 | Viewed by 1246
Abstract
In order to improve the effectiveness of partial discharge detection in attached metal particle insulators, this paper proposes a partial discharge detection method for particle defects in insulators under high-frequency sinusoidal voltage excitation. In order to study the development process of partial discharge [...] Read more.
In order to improve the effectiveness of partial discharge detection in attached metal particle insulators, this paper proposes a partial discharge detection method for particle defects in insulators under high-frequency sinusoidal voltage excitation. In order to study the development process of partial discharge under high-frequency electrical stress, a two-dimensional plasma simulation model of partial discharge with particle defects at the epoxy interface is established under plate–plate electrode structure, which realizes the dynamic simulation of particulate defect partial discharge. By studying the microscopic mechanism of partial discharge, the spatial and temporal distribution characteristics of microscopic parameters such as electron density, electron temperature, and surface charge density are obtained. Based on this simulation model, this paper further studies the partial discharge characteristics of epoxy interface particle defects at different frequencies, and verifies the accuracy of the model from two aspects of discharge intensity and surface damages through experimental means. The results show that with the increase in the frequency of applied voltage, the amplitude of electron temperature shows an increasing trend. However, the surface charge density gradually decreases with the increase in frequency. These two factors make partial discharge severest when the frequency of the applied voltage is 15 kHz. Full article
(This article belongs to the Special Issue Current Research on Dielectric Properties of Polymer Composites)
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10 pages, 2710 KiB  
Article
Exploration of Breakdown Strength Decrease and Mitigation of Ultrathin Polypropylene
by Daniel Q. Tan, Yichen Liu, Xiaotian Lin, Enling Huang, Xi Lin, Xudong Wu, Jintao Lin, Ronghai Luo and Tianxiang Wang
Polymers 2023, 15(10), 2257; https://doi.org/10.3390/polym15102257 - 10 May 2023
Cited by 3 | Viewed by 2203
Abstract
Polypropylene film is the most important organic dielectric in capacitor technology; however, applications such as power electronic devices require more miniaturized capacitors and thinner dielectric films. The commercial biaxially oriented polypropylene film is losing the advantage of its high breakdown strength as it [...] Read more.
Polypropylene film is the most important organic dielectric in capacitor technology; however, applications such as power electronic devices require more miniaturized capacitors and thinner dielectric films. The commercial biaxially oriented polypropylene film is losing the advantage of its high breakdown strength as it becomes thinner. This work carefully studies the breakdown strength of the film between 1 and 5 microns. The breakdown strength drops rapidly and hardly ensures that the capacitor reaches a volumetric energy density of 2 J/cm3. Differential scanning calorimetry, X-ray, and SEM analyses showed that this phenomenon has nothing to do with the crystallographic orientation and crystallinity of the film but is closely related to the non-uniform fibers and many voids produced by overstretching the film. Measures must be taken to avoid their premature breakdown due to high local electric fields. An improvement below 5 microns will maintain a high energy density and the important application of polypropylene films in capacitors. Without destroying the physical properties of commercial films, this work employs the ALD oxide coating scheme to augment the dielectric strength of a BOPP in the thickness range below 5 μm, especially its high temperature performance. Therefore, the problem of the reduction in dielectric strength and energy density caused by BOPP thinning can be alleviated. Full article
(This article belongs to the Special Issue Current Research on Dielectric Properties of Polymer Composites)
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15 pages, 3516 KiB  
Article
Reducing the Permittivity of Polyimides for Better Use in Communication Devices
by Yuwei Chen, Yidong Liu and Yonggang Min
Polymers 2023, 15(5), 1256; https://doi.org/10.3390/polym15051256 - 1 Mar 2023
Cited by 4 | Viewed by 1814
Abstract
Recent studies have shown that introducing fluorinated groups into polyimide (PI) molecules can effectively reduce the dielectric constant (Dk) and dielectric loss (Df) of PIs. In this paper, 2,2′-bis[4-(4-aminophenoxy) phenyl]-1,1′,1′,1′,3,3′,3′-hexafluoropropane (HFBAPP), 2,2′-bis(trifluoromethyl)-4,4′-diaminobenzene (TFMB), diaminobenzene ether (ODA), 1,2,4,5-Benzenetetracarboxylic anhydride (PMDA), 3,3′,4,4′-diphenyltetracarboxylic anhydride (s-BPDA) and [...] Read more.
Recent studies have shown that introducing fluorinated groups into polyimide (PI) molecules can effectively reduce the dielectric constant (Dk) and dielectric loss (Df) of PIs. In this paper, 2,2′-bis[4-(4-aminophenoxy) phenyl]-1,1′,1′,1′,3,3′,3′-hexafluoropropane (HFBAPP), 2,2′-bis(trifluoromethyl)-4,4′-diaminobenzene (TFMB), diaminobenzene ether (ODA), 1,2,4,5-Benzenetetracarboxylic anhydride (PMDA), 3,3′,4,4′-diphenyltetracarboxylic anhydride (s-BPDA) and 3,3′,4,4′-diphenylketontetracarboxylic anhydride (BTDA) were selected for mixed polymerization to find the relationship between the structure of PIs and dielectric properties. Firstly, different structures of fluorinated PIs were determined, and were put into simulation calculation to learn how structure factors such as fluorine content, the position of fluorine atom and the molecular structure of diamine monomer affect the dielectric properties. Secondly, experiments were carried out to characterize the properties of PI films. The observed change trends of performance were found to be consistent with the simulation results, and the possible basis of the interpretation of other performance was made from the molecular structure. Finally, the formulas with the best comprehensive performance were obtained respectively. Among them, the best dielectric properties were 14.3%TFMB/85.7%ODA//PMDA with dielectric constant of 2.12 and dielectric loss of 0.00698. Full article
(This article belongs to the Special Issue Current Research on Dielectric Properties of Polymer Composites)
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18 pages, 9003 KiB  
Review
Recent Progress of Low Dielectric and High-Performance Polybenzoxazine-Based Composites
by Zexu Fan, Bo Li, Dengxun Ren and Mingzhen Xu
Polymers 2023, 15(19), 3933; https://doi.org/10.3390/polym15193933 - 29 Sep 2023
Cited by 5 | Viewed by 1795
Abstract
With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, [...] Read more.
With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, high-speed electronic communication device manufacturing. Consequently, resin-based composites with exceptional low dielectric properties have garnered unprecedented attention. In recent years, benzoxazine-based composites have piqued the interest of scholars in the fields of high-temperature-resistant, low dielectric electronic materials due to their remarkable attributes such as high strength, high modulus, high heat resistance, low curing shrinkage, low thermal expansion coefficient, and excellent flame retardancy. This article focuses on the design and development of modification of polybenzoxazine based on low dielectric polybenzoxazine modification methods. Studies on manufacturing polybenzoxazine co-polymers and benzoxazine-based nanocomposites have also been reviewed. Full article
(This article belongs to the Special Issue Current Research on Dielectric Properties of Polymer Composites)
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