Special Issue "Stretchable and Flexible Electronic Materials & Devices"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 January 2018).
Interests: polymer microsystems technologies; electronics packaging and interconnection; wearable and implantable sensors and electronics circuits; microfluidics; 3D electronics
Interests: biosensor fabrication; hybrid nanomaterial with innovative property and application; flexible transistor and memory devices
Special Issues and Collections in MDPI journals
Special Issue in Applied Sciences: Gold Nanoparticles: Properties and Applications
Interests: surface properties of soft matter; surface anisotropic wettability; oil water separation
Stretchable and flexible electronics are an emerging technology coming in the next few decades. Future photovoltaic panels, wearable health, Internet of things (IoT), and flexible screens, based on organic light emitting diodes (OLED), are examples that will benefit from these cutting edge technologies. The success for the abovementioned pioneering techniques depends on the availability of manufacturing processes for stretchable and flexible electronics, keeping in mind the need for low temperature manufacturing, low energy consumption, lightweight materials, and reliable/rugged devices. Advances in stretchable and flexible electronic materials and devices will inspire versatile new applications, such as in situ diagnosis, silver age home healthcare, wireless sensor networks, and smart street lights, as well as flexible displays, radio frequency identification tags, and therapeutic drug tracking.
It is my pleasure to invite you to submit original research papers within the scope of this Special Issue. Short communication and state-of-the-art reviews will also be greatly appreciated.
Prof. Jan Vanfleteren
Prof. Fu-Hsiang Ko
Prof. Chih-Feng Wang
Dr. Frederick Bossuyt
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
bendable and soft matter
devices on soft substrate
flexible thin film technique
soft transduction medium and structure
spin-coating and dip-coating