Advanced Dielectric Materials: From Classical Insulators to Functional Composites

Dear Colleagues,

Dielectric materials play a key role in energy storage, insulation, and electromagnetic applications, where new composite systems continuously redefine their performance and functional limits.

This Special Issue aims to present the latest advances in dielectric materials, covering both classical insulators and emerging composite systems with enhanced electrical, thermal, and structural properties. Emphasis will be placed on understanding the relationships between composition, morphology, particle size, and dielectric performance across micro-, meso-, and nanoscale domains.

Since the early development of traditional dielectrics such as ceramics, glass, and polymer-based systems, research has gradually evolved toward multifunctional materials that combine high permittivity, low dielectric loss, and improved breakdown strength. This evolution has been accelerated by the integration of nanotechnology and surface-functionalized particles into polymer matrices.

Recent studies have focused on hybrid and nanostructured materials, such as PVDF-based composites, metal–organic frameworks (MOFs), and polymer–ceramic systems, which show tunable dielectric behavior, enhanced energy density, and tailored electromagnetic responses. Progress in material synthesis, interface engineering, and modeling has opened new pathways for high-performance dielectric applications in sensors, capacitors, and electromagnetic shielding.

This Special Issue seeks original research and comprehensive reviews addressing the synthesis, characterization, modeling, and application of dielectric materials. Topics include, but are not limited to

• Classical dielectric materials (ceramics, glasses, polymers);
• Advanced polymer composites (e.g., PVDF, epoxy, PDMS matrices);
• Metal–organic frameworks (MOFs) and coordination polymers;
• Dielectric properties of materials with micro-, meso-, and nanoscale inclusions;
• Structure–property relationships and dielectric relaxation phenomena;
• Electromagnetic compatibility and shielding performance;
• Modeling and simulation of dielectric behavior;
• Applications in energy storage, sensors, and high-voltage insulation.

We welcome original research articles, short communications, and review papers that highlight new experimental methods, material designs, and theoretical models related to dielectric properties and their technological applications. Studies combining experimental results with computational modeling or addressing the impact of particle size, dispersion, and filler–matrix interfaces are particularly encouraged.

Dr. Bystrík Dolník
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.