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Hydrogels for Flexible Electronics and Biomedical Engineering

This special issue belongs to the section “Gel Applications“.

Special Issue Information

Dear Colleagues,

Hydrogels merge high-performance flexible electronics with living tissues through tailorable mechanics, ionic conductivity, and tailorable chemistry. Recent formulations integrate conductive nanomaterials, dynamic crosslinks, and stimuli-responsive motifs to yield stretchable sensors, a human–machine interface (HMI), self-powered biofuel cells, injectable neural probes, and closed-loop drug-delivery systems. Epidermal patches record electrophysiology without mechanical mismatch, while hydrogel microelectrodes modulate neural circuits in freely moving animals. Smart variants release growth factors, antibiotics, or chemotherapeutics in response to pH, enzymes, or external fields, accelerating wound healing and tumor regression. Soft robotic grippers and organ-on-chip devices further exploit hydrogels to manipulate or model organs under physiologic loads. This Special Issue welcomes original research and reviews on Hydrogels for Flexible Electronics and Biomedical Engineering, such as sensors, flexible electrodes, HMIs, injectable devices, drug-delivery systems, and soft robotics.

Dr. Sen Lin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Gels is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • hydrogel
  • flexible electronics
  • human–machine interface
  • biomedical engineering

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Gels - ISSN 2310-2861