Special Issue "Reliability of Power Electronic Systems"

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "Electrical Power and Energy System".

Deadline for manuscript submissions: 28 February 2021.

Special Issue Editor

Prof. Dr. Ui-Min Choi
Website
Guest Editor
Department of Electronics & IT Media Engneering, Seoul National University of Science & Technolgy, Seoul, South Korea
Interests: power electronics; renewable energy; reliability engineering

Special Issue Information

Dear Colleagues,

Power electronic systems play an important role in a wide range of applications such as renewable energy generation, power transmission, automotive, railway and industrial motor drives for efficient energy generation, distribution and consumption. As power electronic systems have gradually gained an important status, their reliability has become an important issue, since they are regarded as one of the most unreliable parts in a variety of whole systems. A paradigm shift in reliability research in power electronics is going on in terms of the design methodologies, reliability testing concepts, and robustness validation approaches of power electronic components to systems.

Prospective authors are invited to submit original contributions or survey papers for publication in Energies. Topics of interest for this Special Issue include, but are not limited to:

  • Design for reliability in power electronics—robustness and reliability design
  • Stressors and failure mechanisms of power electronic components and systems—impact and status
  • Robustness and reliability validation testing
  • Lifetime modeling and prediction of power electronic components and systems
  • Life cycle cost analysis of power electronic systems
  • Condition monitoring in power electronic systems
  • Optimization for reliability in power electronics
  • Reliability in emerging power devices (e.g. SiC, GaN)
  • Handling reliability in embarked systems: automotive, aircraft and space applications
  • Fault-tolerant strategies and advanced control of power electronic converters
  • Other related topics

Prof. Dr. Ui-Min Choi
Guest Editor

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Power electronics applications
  • Reliability of power electronic components and systems
  • Design for reliability
  • Lifetime modeling and assessment
  • Reliability testing
  • Condition monitoring
  • SiC and GaN

Published Papers (8 papers)

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Research

Open AccessArticle
Reliability Characterization of Gallium Nitride MIS-HEMT Based Cascode Devices for Power Electronic Applications
Energies 2020, 13(10), 2628; https://doi.org/10.3390/en13102628 - 21 May 2020
Abstract
We present a detailed study of dynamic switching instability and static reliability of a Gallium Nitride (GaN) Metal-Insulator-Semiconductor High-Electron-Mobility-Transistor (MIS-HEMT) based cascode switch under off-state (negative bias) Gate bias stress (VGS, OFF). We have investigated drain channel current (IDS, Max [...] Read more.
We present a detailed study of dynamic switching instability and static reliability of a Gallium Nitride (GaN) Metal-Insulator-Semiconductor High-Electron-Mobility-Transistor (MIS-HEMT) based cascode switch under off-state (negative bias) Gate bias stress (VGS, OFF). We have investigated drain channel current (IDS, Max) collapse/degradation and turn-on and rise-time (tR) delay, on-state resistance (RDS-ON) and maximum transconductance (Gm, max) degradation and threshold voltage (VTH) shift for pulsed and prolonged off-state gate bias stress VGS, OFF. We have found that as stress voltage magnitude and stress duration increases, similarly IDS, Max and RDS-ON degradation, VTH shift and turn-on/rise time (tR) delay, and Gm, max degradation increases. In a pulsed off-state VGS, OFF stress experiment, the device instabilities and degradation with electron trapping effects are studied through two regimes of stress voltages. Under low stress, VTH shift, IDS collapse, RDS-ON degradation has very minimal changes, which is a result of a recoverable surface state trapping effect. For high-stress voltages, there is an increased and permanent VTH shift and high IDS, Max and RDS-ON degradation in pulsed VGS, Stress and increased rise-time and turn-on delay. In addition to this, a positive VTH shift and Gm, max degradation were observed in prolonged stress experiments for selected high-stress voltages, which is consistent with interface state generation. These findings provide a path to understand the failure mechanisms under room temperature and also to accelerate the developments of emerging GaN cascode technologies. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
Lifetime Analysis of IGBT Power Modules in Passively Cooled Tidal Turbine Converters
Energies 2020, 13(8), 1875; https://doi.org/10.3390/en13081875 - 12 Apr 2020
Abstract
Thermal cycling is one of the major reasons for failure in power electronic converters. For submerged tidal turbine converters investigating this failure mode is critical in improving the reliability, and minimizing the cost of energy from tidal turbines. This paper considers a submerged [...] Read more.
Thermal cycling is one of the major reasons for failure in power electronic converters. For submerged tidal turbine converters investigating this failure mode is critical in improving the reliability, and minimizing the cost of energy from tidal turbines. This paper considers a submerged tidal turbine converter which is passively cooled by seawater, and where the turbine has fixed-pitch blades. In this respect, this study is different from similar studies on wind turbine converters, which are mostly cooled by active methods, and where turbines are mostly pitch controlled. The main goal is to quantify the impact of surface waves and turbulence in tidal stream velocity on the lifetime of the converter IGBT (insulated gate bipolar transistor) modules. The lifetime model of the IGBT modules is based on the accumulation of fatigue due to thermal cycling. Results indicate that turbulence and surface waves can have a significant impact on the lifetime of the IGBT modules. Furthermore, to accelerate the speed of the lifetime calculation, this paper uses a modified approach by dividing the thermal models into low and high frequency models. The final calculated lifetime values suggest that relying on passive cooling could be adequate for the tidal converters as far as thermal cycling is concerned. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
Comparative Evaluation of Lifetime of Three-Level Inverters in Grid-Connected Photovoltaic Systems
Energies 2020, 13(5), 1227; https://doi.org/10.3390/en13051227 - 06 Mar 2020
Cited by 2
Abstract
The cost of the PV energy reduction is still required to increase the penetration level of PV systems in the energy market. The reliability of PV inverters is one of the important aspects to be enhanced in order to reduce the cost of [...] Read more.
The cost of the PV energy reduction is still required to increase the penetration level of PV systems in the energy market. The reliability of PV inverters is one of the important aspects to be enhanced in order to reduce the cost of PV energy, since it is closely related to the maintenance cost and the annual energy production. In this paper, the lifetime of NPC and T-type inverters, which are three-level inverter topologies that are widely used for PV systems, are comparatively evaluated with a 30 kW grid-connected PV system. It is performed by focusing on power devices since the power electronic components of both converters are the same except for the power devices. Therefore, this result can represent the comparison of the reliability performance of the NPC and T-type inverters. The power loss and temperature distributions of power devices are analyzed and their efficiencies are compared at different power levels with different switching frequencies. The lifetimes of the reliability-critical power devices in the NPC and T-type inverters are estimated, respectively with a one-year mission profile of the PV system, and the results are compared. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
Comparison of Heat-Pipe Cooling System Design Processes in Railway Propulsion Inverter Considering Power Module Reliability
Energies 2019, 12(24), 4676; https://doi.org/10.3390/en12244676 - 09 Dec 2019
Abstract
In this paper, the effect of the heat-pipe cooling system design processes on the reliability of the power module in a railway propulsion inverter was investigated. The existing design processes for the heat-pipe cooling system guarantee that the junction temperature of power devices [...] Read more.
In this paper, the effect of the heat-pipe cooling system design processes on the reliability of the power module in a railway propulsion inverter was investigated. The existing design processes for the heat-pipe cooling system guarantee that the junction temperature of power devices does not exceed the maximum allowable junction temperature when the railway propulsion inverter operates under its mission profile; therefore, each step of the design process was reviewed to analyze the effect of the heat-pipe cooling system. Based on the processes, in the calculation for the required thermal resistance of the heat-pipe cooling system, two difference losses were considered with the thermal resistances of the insulated gate bipolar mode transistor (IGBT) module and the thermal grease at an interface between the baseplate of IGBT module and heat-pipe cooling system. The control scheme and mission profile of the train were taken into account to calculate the power losses. Then, the designed heat-pipe cooling systems were compared in terms of the size and weight. In addition, the junction temperatures and lifetimes of the power module with heat-pipe cooling systems designed by different power losses were estimated and compared. Finally, guidelines for a heat-pipe system cooling design are proposed. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
An Aging-Degree Evaluation Method for IGBT Bond Wire with Online Multivariate Monitoring
Energies 2019, 12(20), 3962; https://doi.org/10.3390/en12203962 - 18 Oct 2019
Cited by 1
Abstract
The aging fracture of bonding wire is one of the main reasons for failure of insulated gate bipolar transistor (IGBT). This paper proposes an online monitoring method for IGBT bonding wire aging that does not interfere with the normal operation of the IGBT [...] Read more.
The aging fracture of bonding wire is one of the main reasons for failure of insulated gate bipolar transistor (IGBT). This paper proposes an online monitoring method for IGBT bonding wire aging that does not interfere with the normal operation of the IGBT module. A quantitative analysis of aging degree was first performed, and the results of multivariate and univariate monitoring were compared. Based on the relationship between the monitoring parameters and the aging of the IGBT bonding wire, gradual damage of the IGBT bond wire was implemented to simulate aging failure and obtain the aging data. Moreover, the change of junction temperature was considered to regulate monitoring parameters. Then, the aging degree was evaluated by an artificial neural network (ANN) algorithm. The experimental results showed the effectiveness of the proposed method. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
An Improved Assessment Method for FMEA for a Shipboard Integrated Electric Propulsion System Using Fuzzy Logic and DEMATEL Theory
Energies 2019, 12(16), 3162; https://doi.org/10.3390/en12163162 - 16 Aug 2019
Cited by 3
Abstract
Shipboard integrated electric propulsion systems (IEPSs) are prone to suffer from system failures and security threats because of their complex functional structures and poor operational environments. An improved assessment method for failure mode and effects analysis (FMEA), integrating fuzzy logic and decision–making trial [...] Read more.
Shipboard integrated electric propulsion systems (IEPSs) are prone to suffer from system failures and security threats because of their complex functional structures and poor operational environments. An improved assessment method for failure mode and effects analysis (FMEA), integrating fuzzy logic and decision–making trial and evaluation laboratory (DEMATEL) theory, is proposed to enhance the system’s reliability and handle the correlation effects between failure modes and causes. In this method, information entropy and qualitative analysis are synthesized to determine the credibility weights of domain experts. Each risk factor and its relative importance are evaluated by linguistic terms and fuzzy ratings. The benchmark adjustment search algorithm is designed to obtain the alpha-level sets of fuzzy risk priority numbers (RPNs) for defuzzification. The defuzzified RPNs are regarded as the inputs for the DEMATEL technique to investigate the causal degrees of failure modes and causes. Accordingly, the risk levels of the failure modes are prioritized with respect to the causal degrees. The practical application to the typical failure modes of the propulsion subsystem is provided. The assessment results show that this system contributes to risk priority decision-making and disastrous accident prevention. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
High-Efficiency Bi-Directional Single-Phase AC/DC Converter Design and Field Application for LVDC Distribution
Energies 2019, 12(11), 2191; https://doi.org/10.3390/en12112191 - 08 Jun 2019
Cited by 1
Abstract
This paper describes the design and field application of a high-efficiency single-phase AC/DC converter that is suitable for distribution lines. First, an appropriate AC/DC converter was designed in consideration of the environment of the application system. In order to ensure high efficiency and [...] Read more.
This paper describes the design and field application of a high-efficiency single-phase AC/DC converter that is suitable for distribution lines. First, an appropriate AC/DC converter was designed in consideration of the environment of the application system. In order to ensure high efficiency and high reliability, we designed an optimum switching element and capacitor suitable for the converter, and the protection element of the AC/DC converter was designed based on these elements. The control function for the power converter suitable for an LVDC distribution system is proposed for highly reliable operation. The AC/DC converter was manufactured based on the design and its performance was verified during application in an actual low-voltage DC (LVDC) distribution grid through tests at the demonstration site. The application to a DC distribution system in an actual grid is very rare and it is expected that it will contribute to the expansion of LVDC distribution. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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Open AccessArticle
A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications
Energies 2019, 12(7), 1319; https://doi.org/10.3390/en12071319 - 05 Apr 2019
Cited by 3
Abstract
In this paper, the impact of a double-sided press-pack insulated-gate-bipolar-transistor (PP IGBT) cooling structure on its thermal impedance distribution is studied and explored. A matrix thermal impedance network model is built by considering the multi-chip thermal coupling effect for the collector side of [...] Read more.
In this paper, the impact of a double-sided press-pack insulated-gate-bipolar-transistor (PP IGBT) cooling structure on its thermal impedance distribution is studied and explored. A matrix thermal impedance network model is built by considering the multi-chip thermal coupling effect for the collector side of the PP IGBT. Moreover, a verification has been made by comparing the proposed matrix thermal network model and the conventional lumped RC network model provided by the manufacturer. It is concluded that the collector side has lower thermal resistance and dissipates about 88% of the heat generated by the IGBT chips inside the module. Then, a modular-multilevel-converter high-voltage-direct-current (MMC-HVDC)-based type test setup composed of the press-pack IGBT stacks is established and the junction temperature is calculated with the proposed thermal model and verified by temperature measurements. Full article
(This article belongs to the Special Issue Reliability of Power Electronic Systems)
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