Microstructure and Reliability of Electronic Packaging Materials
A special issue of Crystals (ISSN 2073-4352).
Deadline for manuscript submissions: 10 September 2025 | Viewed by 72
Special Issue Editors
Interests: electronic packaging; integration; microstructural anisotropy; reliability; atom migration; computational science
Interests: electronic packaging; reliability; soldering; sintering; liquid metal TIM; electro-thermo-mechanical coupled loads; electromigration
Interests: lighting optics; imaging/nonimaging design; LED packaging; optical system design; volume holography; 3D indoor mapping
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid advancements in technologies such as artificial intelligence, high-performance computing, and new energy vehicles, electronic packaging and heterogeneous integration have garnered increasing attention. As electronic systems become more multifunctional and sophisticated, the demands for high performance and reliability in packaging materials have become more stringent. The microstructures of these materials play a critical role in determining interconnected performance and overall reliability, particularly as interconnected feature sizes continue to decrease. Understanding how factors such as grain boundaries, phase segregation, porosity, and the growth of intermetallic compounds affect the stability and durability of interconnect packaging is essential for high-performance manufacturing and improving the reliability of advanced microelectronic and power devices.
This Special Issue, titled "Microstructure and Reliability of Electronic Packaging Materials", will gather cutting-edge research on a wide range of topics, including grain growth, voiding issues, phase segregation and coarsening, intermetallic compound growth, and the effects of microstructure evolution on the reliability of packaging materials during manufacturing or service provision, along with other key considerations for packaging technology. We look forward to receiving valuable contributions and support from experts working in these fields.
Dr. Shuibao Liang
Dr. Wangyun Li
Prof. Dr. Ching-Cherng Sun
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Crystals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- electronic packaging
- heterogeneous integration
- solder interconnect
- liquid metal
- power electronics
- integrated circuit
- bonding
- sintering
- reliability
- electromigration
- thermomigration
- mechanical behavior
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.
