Microstructure and Reliability of Electronic Packaging Materials
A special issue of Crystals (ISSN 2073-4352).
Deadline for manuscript submissions: 10 September 2025 | Viewed by 85
Special Issue Editors
Interests: electronic packaging; integration; microstructural anisotropy; reliability; atom migration; computational science
Interests: electronic packaging; reliability; soldering; sintering; liquid metal TIM; electro-thermo-mechanical coupled loads; electromigration
Interests: lighting optics; imaging/nonimaging design; LED packaging; optical system design; volume holography; 3D indoor mapping
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid advancements in technologies such as artificial intelligence, high-performance computing, and new energy vehicles, electronic packaging and heterogeneous integration have garnered increasing attention. As electronic systems become more multifunctional and sophisticated, the demands for high performance and reliability in packaging materials have become more stringent. The microstructures of these materials play a critical role in determining interconnected performance and overall reliability, particularly as interconnected feature sizes continue to decrease. Understanding how factors such as grain boundaries, phase segregation, porosity, and the growth of intermetallic compounds affect the stability and durability of interconnect packaging is essential for high-performance manufacturing and improving the reliability of advanced microelectronic and power devices.
This Special Issue, titled "Microstructure and Reliability of Electronic Packaging Materials", will gather cutting-edge research on a wide range of topics, including grain growth, voiding issues, phase segregation and coarsening, intermetallic compound growth, and the effects of microstructure evolution on the reliability of packaging materials during manufacturing or service provision, along with other key considerations for packaging technology. We look forward to receiving valuable contributions and support from experts working in these fields.
Dr. Shuibao Liang
Dr. Wangyun Li
Prof. Dr. Ching-Cherng Sun
Guest Editors
Manuscript Submission Information
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Keywords
- electronic packaging
- heterogeneous integration
- solder interconnect
- liquid metal
- power electronics
- integrated circuit
- bonding
- sintering
- reliability
- electromigration
- thermomigration
- mechanical behavior
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