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Vacuum Deposition Technologies and Semiconductor Applications

This special issue belongs to the section “Thin Films“.

Special Issue Information

Dear Colleagues,

Nanoscale thin films play a fundamental role in various applications, encompassing coatings, surface treatments, semiconductor devices, and so on. The deposition of thin films allows for the refinement of elemental surface layers, ensuring specific functional properties while potentially utilizing cost-effective core materials. Among the many techniques enhancing the functional properties of engineering materials surfaces, vacuum methods play an important role in industrial practice. The aim of this Special Issue is to provide a platform where academics, industry experts, and researchers worldwide can share their research achievements and exchange experiences within the field of vacuum deposition and semiconductor applications. This SI warmly welcomes the works from the Conference on Chinese Vacuum Technologies and Semiconductor Applications 2023.

Topics of interest include but are not limited to:

  1. Theoretical and experimental research in vacuum thin-film deposition methods;
  2. Thin-film processes and related devices, including chemical vapour deposition (CVD); physical vapour deposition (PVD) and atomic layer deposition (ALD)...;
  3. The application of vacuum thin-film deposition, including memory, metal oxide semiconductor field effect transistors (MOSFETs), thin-film transistors (TFTs), sensors, ...

Prof. Dr. Hongliang Lu
Prof. Dr. Gang He
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • vacuum thin-film deposition
  • surface and interface
  • memory device
  • MOSFET
  • thin-film transistors
  • sensors
  • semiconductor

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Coatings - ISSN 2079-6412