Special Issue "Science and Technology of Flexible Films and Devices"
Deadline for manuscript submissions: 31 May 2022.
The recent development of materials and devices in flexible electronics has attracted great attention and provided many opportunities for wearable electronics, human–machine interfaces, Internet of things, and many others. One of the keys to the success of flexible electronics is the development of functional flexible thin films, since flexible electronics technology is highly relevant to thin-film technology. The science and technology of flexible thin-films and devices, associated with the development of novel functional thin films (organic and inorganic semiconducting, conducting, and insulating materials), the exploitation of advanced film deposition methods (chemical/physical vapor deposition, spin-casting, printing, etc.), mechanics design of flexible devices (computational simulation and experiments), and the fabrication of thin-film devices (micro-FAB, assembly, integration, etc.) are extremely important for both academia and industry.
This Special Issue will serve as a forum for papers in the following concepts, but not limited to these:
- Materials for flexible thin films and devices.
- Novel deposition and processing techniques for flexible thin films and flexible devices.
- Mechanics designs and computational simulations for flexible thin films and flexible electronics.
- Applications of flexible thin films and flexible devices.
- Physics and chemistry of thin films and thin-film devices.
- Novel thin-film devices showing potential for flexible electronics.
Assist. Prof. Xinge Yu
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- thin-film devices
- flexible electronics
- thin-film mechanics
- advanced coating techniques