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Digital Transformation in the Architecture, Engineering and Construction (AEC) Industry

This special issue belongs to the section “Construction Management, and Computers & Digitization“.

Special Issue Information

Dear Colleagues,

This Special Issue will focus on the digital transformation of the Architecture, Engineering, and Construction (AEC) industry, highlighting how emerging technologies are reshaping project planning, design, construction, and facility management. The integration of Building Information Modeling (BIM), artificial intelligence, big data, the Internet of Things (IoT), and blockchain technology is accelerating the shift toward smart construction and sustainable development.

We welcome original contributions from both academia and industry that explore the application of digital tools, cross-disciplinary collaboration, data integration, and innovative business models. This Special Issue aims to enhance efficiency, quality, and innovation across the AEC sector by addressing the opportunities and challenges of digitalization.

We expect that our collective efforts will help pave the way for an AEC industry that is not only technologically advanced but also sustainable and resilient in the face of the uncertainties of the 21st century. The suggested topics include, but are not limited to, the following:

  • Blockchain technology applications;
  • The Internet of Things (IoT);
  • Occupational health and safety;
  • Cognitive science;
  • Data and visual analytics;
  • Cutting-edge technologies;
  • Computer vision;
  • Generative design;
  • Intelligent risk assessment;
  • AR-enhanced structural engineering;
  • The use of advanced automated decision-making systems in quality inspection;
  • The use of computer vision and ontology in construction quality control;
  • Smart construction;
  • Building and City Information Modeling (BIM/CIM);
  • Intelligent information processing;
  • Building information technologies;
  • Infrastructure health monitoring;
  • Disaster early warning systems;
  • Resilient city development. 

More examples of Special Issues of Buildings can be found at https://www.mdpi.com/journal/buildings/special_issues.

Original research articles, case studies, and review papers are all welcome for this Special Issue.

Dr. Yi-Hsin Lin
Dr. Pin-Chao Liao
Dr. Ting-Kwei Wang
Dr. Zhao Xu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Buildings is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • BIM
  • blockchain technology applications
  • AR-enhanced structural engineering
  • data and visual analytics
  • smart construction
  • infrastructure health monitoring
  • resilient city development

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Buildings - ISSN 2075-5309