Special Issue "Designing Tissue Scaffolds with Electrospun Fibers"

A special issue of Bioengineering (ISSN 2306-5354).

Deadline for manuscript submissions: 31 May 2019

Special Issue Editor

Guest Editor
Assoc. Prof. Urszula Stachewicz

AGH University of Science and Technology, Faculty of Metals Engineering and Industrial Computer Science, International Centre of Electron Microscopy for Materials Science, Al. A. Mickiewicza 30, 30-059 Kraków, Poland
Website | E-Mail
Interests: fibers; meshes; polymers; electrospinning; electrospraying; microscopy; 3D tomography; FIB-SEM; surface properties; tissue engineering; nanomechanics

Special Issue Information

Dear Colleagues,

Electrospinning is a versatile technique allowing to obtain meshes characterized by a high surface area, which gives enormous advantages in cell culture studies. Many adjustments with surface geometry and roughness, chemistry, and other properties are leading to different cell responses and controlled tissue growth or cell differentiation. The flexibility in obtaining different structures of electrospun scaffolds, including core shell structures for drug delivery systems, provides a wide range of applications. Therefore, we welcome contributions on fundamental and application research concerning all types of electrospun materials, from ceramics to hydrogels and polymers, ferroelectrics, magnetic to biodegradable or composites structures, for various applications; for example, cardiovascular, skin, bone, wound healing or drug deliveries and many others that required tissue engineering solutions.

This Special Issue of Bioengineering aims to discuss, collect and offer recent highlights and advances on new designs and studies of tissue scaffolds with electrospun fibers. All new progress and developments of scaffolds systems, productions methods and fundamental understanding of the produced surfaces and meshes and cells responses to it will be considered in this topic, but it is not limited to it as the electrospun fibers are used in many bioengineering devices for diagnosis applications as well.

Assoc. Prof. Urszula Stachewicz
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Bioengineering is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 550 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Electrospun fibers
  • Cells culture study
  • Scaffolds design
  • Biocompatibility
  • Tissue engineering

Published Papers

This special issue is now open for submission.
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