Special Issue "PICs for Optical Interconnects"
Deadline for manuscript submissions: closed (10 October 2019).
Interests: optical interconnects; integrated photonics; integrated photonic meshes; optical memories; 5G networks
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Interests: optical interconnects; integrated photonics; optical memories
At the dawn of the Zettabyte era, the increasing demand for high-bandwidth Internet applications and cloud-based solutions have been driving an immense network traffic explosion, stimulating the rise of hyperscale data centers. Currently, the portion of traffic residing within the data center network exceeds 75% of its overall traffic-load, which in turn is expected to quadruple by 2021, constantly pushing for more efficient interconnect solutions. Towards addressing the vast network scaling, photonic integration has been heralded as the key enabling technology with its growing maturity achieving a doubling of the optical linerate on an annual basis. Currently, the adoption of 400Gb/s is ramping up, while latest worldwide research efforts are unravelling application-specific Photonic Integrated Chips (PICs) with unparalleled performance in terms of bandwidth, power-efficiency and cost-expenses at all levels of the hierarchy, starting from rack-to-rack, board-to-board and chip-to-chip, deploying a wealth of photonic integration platforms, spanning from electro-optic boards, silicon photonics, III-V materials, as well as novel materials.
The main purpose of this Special Issue is to cover all topics of latest research and developments in the field of “PICs for Optical Interconnects”. This will be an open call for papers and we are seeking research contributions in the following areas:
- Optical interconnect system architectures
- Active optical cables and mid-board optics
- On-chip and short-reach optical interconnect technologies
- Electrical–optical PCB technologies and pluggable optical connectors
- 3D integration, assembly and packaging
- Large scale photonic switches and routing technologies
- Silicon photonic PICs and III-V/Si laser sources
- Optical memories and optically-interconnected memories
- Photonic crystals, plasmonic devices and novel materials
- Neuromorphic photonics
Dr. Christos Vagionas
Dr. Theoni Alexoudi
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
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