Photonic Integrated Circuits for Optical Communications

Dear Colleagues,

The unprecedented demands on the Internet due to the proliferation of several bandwidth-intensive multimedia technologies, applications and services have resulted in huge broadband connections. The demands of communication systems can be efficiently attended to with the emerging super-channel transmission and large-scale photonic solutions. There has been a great prospect for exceptionally low-cost photonic solutions with the fabrication of silicon photonic devices in complementary metal oxide semiconductor (CMOS) environments. Silicon chip-based integrated optics technology and other variants like InP and SiN have been attracting considerable interest as they encourage the easy fabrication of very complex photonic integrated circuits (PIC) for optical communications. This helps to alleviate the complexity of optical components and stability limitation. Therefore, PIC helps in enhancing the system feasibility by offering advantages such as a low footprint, low power consumption and cost effectiveness. PICs have the potential of enabling high density, high data rates and flexible solutions in telecommunications and other fields. From intra-chip to chip-to-chip and chip-to-board, PICs may be used and will enable great advances when they have matured sufficiently and developed for all ecosystems, following the integrated electronics example. However, like any other emerging technologies, PIC design comes with a number of specific challenges such as thermal management, packaging, RF interface management, circuit modelling and ecosystem development, that demand concerted efforts to be addressed. We invite prospective authors to submit innovative and high-quality papers with original perspectives on any of the PIC-related topics.

Prof. Dr. António Luís Jesus Teixeira
Dr. Isiaka Alimi
Guest Editors

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