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New Trends in Flexible Electronics

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: closed (28 February 2022) | Viewed by 615

Special Issue Editors


E-Mail Website
Guest Editor
Micro Nano Optoelect Mat & Devices Int Sci & Tech, Chongqing Univ Arts & Sci, Chongqing 402160, China
Interests: flexible electronics; flexible substrates; composite materials; sensors

E-Mail Website
Guest Editor
Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China
Interests: image processing; computer vision; machine learning

Special Issue Information

Dear Colleagues,

Flexible electronics with inorganic/organic devices attached to flexible substrates to form circuits have received extensive attention as future electronics during the past several years. Compared with traditional silicon electronics, flexible electronics can be bent, folded, twisted, compressed, stretched, and even transformed into arbitrary shapes, while maintaining high efficiency, reliability, and integration. They have wide application prospects in the fields of information, energy, medical treatment, and so on. Moreover, with the rise of wearable electronic devices, the demand for flexible electronic industrialization is more urgent, indicating that the flexible electronic industry will not stay in the field of concept and laboratory, but enter into everyday life. Due to the wide development space of flexible electronic technology, more and more researchers are beginning to join the research in flexible electronics.

Applied Sciences is a leading academic journal that publishes cutting-edge research in its field. The journal is planning a Special Issue focused on the progress in flexible electronics. The topics of interest for this Special Issue include but are not limited to:

  • Structure of flexible electronics;
  • Materials of flexible electronics;
  • Manufacture of flexible electronics;
  • Flexible thin-film transistors;
  • Flexible displays;
  • Flexible energy devices;
  • Flexible sensors;
  • Flexible wireless transmission devices;
  • Flexible integrated circuits and systems;
  • Testing and reliability.

Prof. Dr. Lu Li
Prof. Dr. Lei Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers

There is no accepted submissions to this special issue at this moment.
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