applsci-logo

Journal Browser

Journal Browser

Advanced Thin Film Technologies: Surface and Interface Engineering with Nanomaterials

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Nanotechnology and Applied Nanosciences".

Deadline for manuscript submissions: 20 July 2025 | Viewed by 385

Special Issue Editors


E-Mail Website
Guest Editor
School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: surface science; radiative cooling; hydrovoltaic; superhydrophobicity; water evaporation

E-Mail Website
Guest Editor
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: separation membrane; ion exchange membrane; nanocomposite; fiber composite

E-Mail Website
Guest Editor Assistant
Academy for Engineering and Technology, Fudan University, Shanghai 200433, China
Interests: advanced packaging materials; power electronics module packaging; silicon carbide-based superjunction device

Special Issue Information

Dear Colleagues,

Thin film technologies have revolutionized numerous fields, from electronics and energy to healthcare and environmental applications. As a pivotal area in materials science, the engineering of surfaces and interfaces at the nanoscale enables the development of advanced materials with exceptional properties. The performance and functionality of thin films are profoundly influenced by surface treatments and interface control, which govern phenomena such as adhesion, conductivity, optical behavior, and mechanical strength.

This Special Issue, entitled “Advanced Thin Film Technologies: Surface and Interface Engineering with Nanomaterials”, invites researchers to share their latest findings and innovative approaches in this dynamic field. Topics of interest include, but are not limited to, cutting-edge surface modification techniques, interface engineering methods, the characterization of thin film properties, and the novel applications of nanomaterial-based thin films. Contributions that explore interdisciplinary approaches, sustainable practices, or address emerging challenges in thin film technology are particularly encouraged.

Through this Special Issue, we aim to showcase the most recent advancements and foster collaboration among scientists and engineers working at the intersection of thin film technology and nanomaterials. We welcome original research, reviews, and case studies that highlight the potential and versatility of thin films in shaping future technologies.

Dr. Wenluan Zhang
Dr. Yumin Huang
Guest Editors

Dr. Pan Liu
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thin film technology
  • surface treatment
  • interface engineering
  • nanomaterials
  • coating processes
  • surface modification
  • nanoscale interfaces

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

19 pages, 5091 KiB  
Article
Topological and Fractal Analysis of Nanostructured Metal–Dielectric Films
by Ivan Bolesta, Oleksii Kushnir, Ivan Karbovnyk, Halyna Klym, Marina Konuhova and Anatoli I. Popov
Appl. Sci. 2025, 15(6), 3250; https://doi.org/10.3390/app15063250 - 17 Mar 2025
Viewed by 233
Abstract
The surface topology and fractal dimension of ultrathin silver and gold films have been investigated utilizing atomic force microscopy. These films were formed at the early stages of metal deposition through thermal evaporation and have pre-percolation thicknesses. They contain both metallic and insulating [...] Read more.
The surface topology and fractal dimension of ultrathin silver and gold films have been investigated utilizing atomic force microscopy. These films were formed at the early stages of metal deposition through thermal evaporation and have pre-percolation thicknesses. They contain both metallic and insulating (void) phases, making them metal–dielectric composites. We identified the main parameters of the microstructure, such as the size of the metallic particles and surface roughness, as well as the dependence of these parameters on the film thickness and substrate parameters. Approaches to processing data, including correlation analysis, were employed. An analysis of dependencies and an explanation of their appearance were conducted. The discussion also addressed the limitations of using atomic force microscopy for studying ultrathin metal films. We determined the various types of fractal dimensions, considering the film topology for two- as well as three-dimensional objects. Depending on the actual dimensions of the phase boundary for silver films, a maximum was found. Different approaches to determining the fractal dimensions in 3Ds case show a similar dependence, but different values. Full article
Show Figures

Figure 1

Back to TopTop