Recent Advances in CMP Slurries and Post-CMP Cleaning
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".
Deadline for manuscript submissions: closed (1 July 2023) | Viewed by 14616
Special Issue Editors
Interests: chemical mechanical polishing; cleaning process; nanoparticles; adsorption; slurry; dispersion
Interests: semiconductor process; electrochemistry; chemical mechanical planarization; slurry; galvanic corrosion
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Semiconductor technology has grown rapidly in recent decades as emerging technologies such as autonomous driving, artificial intelligence (AI), 5G communications, the Internet of Things (IoT), and large-scale data processing are increasingly integrated into our daily lives. Semiconductor innovation is a key driver of progress in many of these emerging technologies.
Chemical mechanical planarization (CMP) is one of the most critical processes for high-volume and high-yield semiconductor manufacturing. CMP has evolved and become increasingly sophisticated over the years and has enabled the development of state-of-the-art semiconductor devices. One of the current goals of CMP is to accelerate the discovery of new materials and their integration into semiconductor manufacturing, which requires an understanding of the fundamental principles of materials and their performances during the CMP process.
This Special Issue will cover recent advances in our fundamental understanding, advanced technologies, and new material development with a focus on CMP slurries and post-CMP cleaning for advanced technology nodes. This will bring together a diverse set of leading researchers and engineers—from academic to industrial and fundamental principles to fab-based CMP processes—who focus on new materials, advances in materials characterization, materials design, modeling, and fundamental material science in the CMP field.
Prof. Dr. Jihoon Seo
Dr. Kangchun Lee
Guest Editors
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Keywords
- semiconductor manufacturing processing
- chemical mechanical planarization (CMP)
- post-CMP cleaning
- slurry
- polishing
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