Artificial Intelligence in Material Science and Failure Analysis
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".
Deadline for manuscript submissions: closed (30 March 2024) | Viewed by 300
Special Issue Editors
Interests: material and damage analytics; thin films; mechanical properties; laser ultrasound
Special Issues, Collections and Topics in MDPI journals
Interests: reliability and analytics for assembly and interconnects; assembly and interconnect technology; reliability testing; microelectronics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We invite contributions ranging from experimental techniques to data analysis to drive applied material science and modern failure analysis. The aim of this Special Issue is to incorporate and combine topics such as the development and application of (1) experimental methods and methodological workflows for modern material research and reliability testing, (2) computational modelling and simulations, and (3) artificial intelligence-based concepts for advanced data analysis and embedded computing systems. This Special Issue will address, but is not limited to, material-related topics in the field of energy storage and conversion, microelectronics, powers semiconductors, additive manufacturing, lightweight materials, etc.
Dr. Roland Brunner
Dr. Elke Kraker
Guest Editors
Manuscript Submission Information
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Keywords
- machine learning
- artificial intelligence
- imaging
- image analysis
- material characterization
- failure analysis
- energy storage and conversion
- microelectronics
- additive manufacturing
- lightweight materials
- modeling and simulation
- embedded computing
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