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Precision and Ultra-Precision Machining Technology and Its Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: 20 May 2025 | Viewed by 1814

Special Issue Editor


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Guest Editor
School of Mechanical Engineering, Shandong University, Jinan 250061, China
Interests: precision and ultra-precision abrasive machining; diamond wire saw slicing technology; semiconductor abrasive processing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Precision and ultra-precision machining technology has been used widely in manufacturing many mission-critical components for various industrial areas, such as semiconductor chips, PV silicon solar cells, advanced optics, aerospace, automotive, telecommunications, etc. Most materials used in these fields, such as semiconductors, laser crystals, engineering ceramics, optical glass, superalloys, composite materials, etc., are difficult to process. The increasing degree of high-precision and high-efficiency requirements and the difficult-to-machine characteristics of advanced materials lead to numerous challenges in researching different fields of precision and ultra-precision machining technology, such as novel machining processes, processing mechanics, surface generation mechanisms, novel machine design, advanced sensing, machine metrology, machining process modeling and simulation, process monitoring, etc. This collection aims to provide updates on the research in advanced abrasive processing technology and its applications. The scope of this Special Issue includes, but is not limited to, the following topics:

  • Precision and ultra-precision machining technology in semiconductor, optical, photovoltaic and other fields;
  • The basic theories of precision and ultra-precision machining, such as cutting, grinding, lapping, polishing, etc.;
  • The modeling, simulation, and optimization of precision and ultra-precision machining processes;
  • Multi-energy-field-assisted precision and ultra-precision machining technology;
  • The surface integrity of precision and ultra-precision machining and its detection and control technology;
  • Precision and ultra-precision machining tools and equipment;
  • Intelligent manufacturing technology and equipment for precision and ultra-precision machining;
  • Other related precision and ultra-precision machining technologies.

Prof. Dr. Yufei Gao
Guest Editor

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Keywords

  • cutting
  • grinding
  • lapping
  • polishing
  • precision and ultra-precisionmachining mechanism
  • modeling and simulation
  • multi-energy-field-assisted  machining
  • surface integrity
  • machining tools and equipment
  • processing monitoring

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Published Papers (1 paper)

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Research

15 pages, 5600 KiB  
Article
Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal
by Yihe Liu, Dameng Cheng, Guanzheng Li and Yufei Gao
Appl. Sci. 2024, 14(17), 7667; https://doi.org/10.3390/app14177667 - 30 Aug 2024
Viewed by 1336
Abstract
During the diamond wire saw cutting process of sapphire crystals, warpage is one of the key parameters for evaluating wafer quality. Based on the thermoelasticity theory and diamond wire saw cutting theory, a finite element model for thermal analysis of diamond wire saw [...] Read more.
During the diamond wire saw cutting process of sapphire crystals, warpage is one of the key parameters for evaluating wafer quality. Based on the thermoelasticity theory and diamond wire saw cutting theory, a finite element model for thermal analysis of diamond wire saw cutting sapphire crystals was established in this paper. The variation laws and internal connections of the temperature field and thermal deformation displacement field of the wafer during the sawing process were analyzed. A calculation and analysis model for the warpage of sapphire crystal wafer cut by wire saw was established based on the node thermal deformation displacement field of the wafer, and the rationality of the simulation results was verified through sawing experiments. This simulation calculation model constructs the mapping relationship between the process parameters of diamond wire sawing and the sapphire wafer warpage during sawing. The influence of wafer thickness, diamond wire speed, feed rate, diamond wire diameter, and tension on the warpage of the wafer was studied using the simulation model. The results indicate that the highest temperature occurs in the sawing area during cutting. The wafer thickness decreases and the warpage increases. The wafer warpage decreases with the increase of the diamond wire tension and diameter, and increases with the increase of diamond wire speed and feed rate. The research results provide a reference for understanding the variation of wafer warpage during sawing and optimizing sawing process parameters. Full article
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