Precision and Ultra-Precision Machining Technology and Its Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: 30 October 2024 | Viewed by 72

Special Issue Editor


E-Mail Website1 Website2
Guest Editor
School of Mechanical Engineering, Shandong University, Jinan 250061, China
Interests: precision and ultra-precision abrasive machining; diamond wire saw slicing technology; semiconductor abrasive processing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Precision and ultra-precision machining technology has been used widely in manufacturing many mission-critical components for various industrial areas, such as semiconductor chips, PV silicon solar cells, advanced optics, aerospace, automotive, telecommunications, etc. Most materials used in these fields, such as semiconductors, laser crystals, engineering ceramics, optical glass, superalloys, composite materials, etc., are difficult to process. The increasing degree of high-precision and high-efficiency requirements and the difficult-to-machine characteristics of advanced materials lead to numerous challenges in researching different fields of precision and ultra-precision machining technology, such as novel machining processes, processing mechanics, surface generation mechanisms, novel machine design, advanced sensing, machine metrology, machining process modeling and simulation, process monitoring, etc. This collection aims to provide updates on the research in advanced abrasive processing technology and its applications. The scope of this Special Issue includes, but is not limited to, the following topics:

  • Precision and ultra-precision machining technology in semiconductor, optical, photovoltaic and other fields;
  • The basic theories of precision and ultra-precision machining, such as cutting, grinding, lapping, polishing, etc.;
  • The modeling, simulation, and optimization of precision and ultra-precision machining processes;
  • Multi-energy-field-assisted precision and ultra-precision machining technology;
  • The surface integrity of precision and ultra-precision machining and its detection and control technology;
  • Precision and ultra-precision machining tools and equipment;
  • Intelligent manufacturing technology and equipment for precision and ultra-precision machining;
  • Other related precision and ultra-precision machining technologies.

Prof. Dr. Yufei Gao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • cutting
  • grinding
  • lapping
  • polishing
  • precision and ultra-precisionmachining mechanism
  • modeling and simulation
  • multi-energy-field-assisted  machining
  • surface integrity
  • machining tools and equipment
  • processing monitoring

Published Papers

This special issue is now open for submission.
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