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Advances in Microelectromechanical Systems (MEMS): Materials and Devices
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Advances in Microelectromechanical Systems (MEMS): Materials and Devices

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: closed (30 March 2025) | Viewed by 297

Special Issue Editors

Dr. Kristoffer McKee

E-Mail Website
Guest Editor
School of Civil and Mechanical Engineering, Curtin University, Bentley, WA 6102, Australia
Interests: mechanical vibrations; linear systems and control; MEMS
Special Issues, Collections and Topics in MDPI journals
Dr. Waqas Amin Gill

E-Mail Website
Guest Editor Assistant
School of Civil and Mechanical Engineering, Curtin University, Bentley, WA 6102, Australia
Interests: MEMS; MEMS gyroscope; NEMS; accelerometers; material science

Special Issue Information

Dear Colleagues,

Microelectromechanical system (MEMS) technology has seen tremendous growth and innovation over the past few decades. MEMS technology integrates tiny mechanical and electrical elements into a silicon substrate through microfabrication processes. This Special Issue on "Advances in Microelectromechanical Systems (MEMS): Materials and Devices" will bring together the latest research and developments in the field. Topics of interest include sensors, actuators, energy harvesters, novel materials, inertial measurement units, inertial sensors, and device designs that enhance the performance, reliability, and functionality of MEMS devices. Contributions that explore new applications of MEMSs in various sectors, such as in smart electronic, biomedical, aerospace, automotive, and space applications, are particularly welcome. We encourage researchers to submit original research articles, reviews, and case studies that highlight advancements and future directions in MEMS technology.

Dr. Kristoffer McKee
Guest Editor

Dr. Waqas Amin Gill
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS technology
  • microfabrication
  • MEMS sensors
  • actuators
  • device design
  • novel materials
  • biomedical applications
  • aerospace applications
  • automotive applications
  • consumer electronics
  • inertial mesurement unit
  • inertial sensors

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Published Papers (1 paper)

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Review

54 pages, 16837 KiB  
Review
A Comprehensive Review of Plasma Cleaning Processes Used in Semiconductor Packaging
by Stephen Sammut
Appl. Sci. 2025, 15(13), 7361; https://doi.org/10.3390/app15137361 - 30 Jun 2025
Abstract
Semiconductor device fabrication is conducted through highly precise manufacturing processes. An essential component of the semiconductor package is the lead frame on which the silicon dies are assembled. Impurities such as oxides or organic matter on the surfaces have an impact on the [...] Read more.
Semiconductor device fabrication is conducted through highly precise manufacturing processes. An essential component of the semiconductor package is the lead frame on which the silicon dies are assembled. Impurities such as oxides or organic matter on the surfaces have an impact on the process yield. Plasma cleaning is a vital process in semiconductor manufacturing, employed to enhance production yield through precise and efficient surface preparation essential for device fabrication. This paper explores the various facets of plasma cleaning, with a particular emphasis on its application in the cleaning of lead frames used in semiconductor packaging. To provide comprehensive context, this paper also reviews the critical role of plasma in advanced and emerging packaging technologies. This study investigates the fundamental physics governing plasma generation, the design of plasma systems, and the composition of the plasma medium. A central focus of this work is the comparative analysis of different plasma systems in terms of their effectiveness in removing organic contaminants and oxide residues from substrate surfaces. By utilizing reactive species generated within the plasma—such as oxygen radicals, hydrogen ions, and other chemically active constituents—these systems enable a non-contact, damage-free cleaning method that offers significant advantages over conventional wet chemical processes. Additionally, the role of non-reactive species, such as argon, in sputtering processes for surface preparation is examined. Sputtering is the ejection of individual atoms from a target surface due to momentum transfer from an energetic particle (usually an ion). Sputtering is therefore a physical process driven by momentum transfer. Energetic ions, such as argon (Ar+), are accelerated from the plasma to bombard a target surface. Upon impact, these ions transfer sufficient kinetic energy to atoms within the material’s lattice to overcome their surface binding energy, resulting in their physical ejection. This paper also provides a comparative assessment of various plasma sources, including direct current, dielectric barrier discharge, radio frequency, and microwave-based systems, evaluating their suitability and efficiency for lead frame cleaning applications. Furthermore, it addresses critical parameters affecting plasma cleaning performance, such as gas chemistry, power input, pressure regulation, and substrate handling techniques. The ultimate aim of this paper is to provide a concise yet comprehensive resource that equips technical personnel with the essential knowledge required to make informed decisions regarding plasma cleaning technologies and their implementation in semiconductor manufacturing. This paper provides various tables which provide the reader with comparative assessments of the various plasma sources and gases used. Scoring mechanisms are also introduced and utilized in this paper. The scores achieved by both the sources and the plasma gases are then summarized in this paper’s conclusions. Full article
(This article belongs to the Special Issue Advances in Microelectromechanical Systems (MEMS): Materials and Devices)
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