Advanced Manufacturing, Assembly, and Testing Technologies for Spacecraft

A special issue of Aerospace (ISSN 2226-4310). This special issue belongs to the section "Astronautics & Space Science".

Deadline for manuscript submissions: 31 March 2026 | Viewed by 36

Special Issue Editor


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Guest Editor
School of Astronautics, Harbin Institute of Technology, Harbin 150001, China
Interests: intelligent assembly and testing; advanced spacecraft and ground testing; advanced manufacturing
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Special Issue Information

Dear Colleagues,

The increasing complexity of spacecraft systems and the demand for high-precision, high-reliability manufacturing have highlighted the need for advanced manufacturing, assembly and testing technologies. Spacecraft undergo a complex lifecycle, including ground-based manufacturing, structural assembly, performance testing, fault detection, and increasingly, in-orbit assembly and in-space manufacturing. Each phase is crucial to ensuring mission success and system reliability.

To meet these demands, a variety of intelligent technologies are being developed and integrated throughout the spacecraft manufacturing chain. These include intelligent spacecraft assembly, flexible grasping and fixture design, automated sealant and adhesive dispensing, and precision measurement and inspection technologies that enhance accuracy and repeatability. Moreover, ground-based simulation systems, such as micro-/low-gravity environment simulation systems, have become essential tools for validating spacecraft performance. Additionally, advanced fault detection and diagnosis technologies ensure robust performance during ground tests and in-orbit operation, improving the overall resilience of space systems.

This Special Issue of Aerospace aims to present the latest advances in advanced manufacturing, assembly, and testing technologies, providing a platform for researchers and engineers to exchange insights on theory, methodology, and practical application. Submissions from academia, research institutes, and industry are welcome, including original research, review articles, and engineering applications.

Finally, I would like to thank Desong Du and Rui Zhou for their valuable work in assisting me with this Special Issue.

Dr. Yanfang Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Aerospace is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • additive manufacturing in aerospace
  • intelligent spacecraft assembly
  • flexible grasping and fixture design
  • automated sealant and adhesive dispensing
  • precision measurement and inspection technologies
  • micro-low-gravity environment simulation technology
  • fault detection and diagnosis technology

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Published Papers

This special issue is now open for submission.
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