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Journal: Mater. Proc., 2022
Volume: 8
Number: 73
73
Article: Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards
Authors: by Márcia Silva, Raimundo Silva, Paulo Nóvoa, Helena M. V. M. Soares, Margarida M. S. M. Bastos and António Marques
Link: https://www.mdpi.com/2673-4605/8/1/73

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