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Journal: Materials ProceedingsVolume: 8Number: 73
Article: Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards
  • Authors:
  • Márcia Silva1,
  • Raimundo Silva2 and
  • Paulo Nóvoa3
  • et al.
Link: https://www.mdpi.com/2673-4605/8/1/73

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