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Journal: Proceedings, 2018
Volume: 2
Number: 833

Article: Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids
Authors: by Thomas Glatzl, Roman Beigelbeck, Samir Cerimovic, Harald Steiner and Albert Treytl
Link: https://www.mdpi.com/2504-3900/2/13/833

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