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Journal: Proceedings, 2018
Volume: 2
Number: 833
Article:
Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids
Authors:
by
Thomas Glatzl, Roman Beigelbeck, Samir Cerimovic, Harald Steiner and Albert Treytl
Link:
https://www.mdpi.com/2504-3900/2/13/833
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