Abstract
Micron-sized spherical gold powders possessing high dispersibility and favorable sintering performance are critical for high-performance thick-film gold conductor pastes. Herein, monodisperse micron-sized spherical gold powders were fabricated through an environmentally benign chemical reduction route, where L-ascorbic acid served as the reductant and gum arabic acted as the dispersant. The influences of solution pH, reaction temperature, stirring speed and reaction time on particle morphology and size distribution were systematically explored. With the mass ratio of gold precursor to reductant maintained at 1:1, the optimal synthetic conditions were determined as pH 3, 20 °C, 550 rpm and 20 min. Under such optimized conditions, spherical gold particles with an average diameter of 0.88 μm were harvested, featuring narrow particle-size distribution, high sphericity, good dispersibility and low organic residue of 0.70 wt%. The as-prepared powder delivered high crystallinity and appropriate sintering activity. Quantitative porosity characterization demonstrated that the thick film derived from this micron-scale gold powder achieved the minimum residual porosity in comparison with the other two counterparts, verifying its outstanding densification behavior. Benefiting from the well-developed dense conductive network, the resultant thick film achieved a low sheet resistance of 1.73 mΩ/sq, a superior adhesion strength of 3.65 N/mm2, as well as reliable multi-firing stability. This work offers a feasible approach for large-scale manufacturing of high-quality gold powders toward thick-film electronic devices.