There were some errors in the original publication [1]. Some text needed to be updated in the Introduction and Sections 2, 3.1, 3.2 and 3.3:
In the Introduction, paragraph 4, the phrase “design acknowledgment” should be updated to “pattern recognition”.
In Section 2, paragraph 1, the phrases “non-straight” and “non-direct” should be updated to “non-linear”.
In Section 2, paragraph 5, the phrases “shrewd household” and “keen matrix” should be updated to “smart home” and “smart grid”.
In Section 3.1, paragraphs 4 and 5, the phrase “picture handling” should be updated to “image processing”, and the phrase “Bragg grinding” should be updated to “Bragg grating”.
In Section 3.2, paragraph 4, the phrase “expanding pattern” should be updated to “increased trend”.
In Section 3.2, paragraph 11, the phrase “huge information” should be updated to “big data”.
In Section 3.3, paragraph 8, the phrase “k-means bundling” should be updated to “k-means clustering”.
In Section 3.3, paragraph 9, the phrase “k-means bunching” should be updated to “K-means clustering”.
The authors state that the scientific conclusions are unaffected. This correction was approved by the Academic Editor. The original publication has also been updated.
Reference
- Sharma, V.B.; Tewari, S.; Biswas, S.; Lohani, B.; Dwivedi, U.D.; Dwivedi, D.; Sharma, A.; Jung, J.P. Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals 2021, 11, 1537. [Google Scholar] [CrossRef] [Scilit]
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