UV Laser Micromachining of FR-4-Based Rigid–Flex PCBs: Predictive Modeling of Penetration Depth Through Design of Experiments

This study developed predictive mathematical models for UV laser penetration depth in FR-4-based rigid–flex printed circuit boards, addressing the critical need for precise material removal in applications like protective plug removal. Utilizing a comprehensive Design of Experiments framework, specifically two-level full factorial designs, the influence of key operational parameters—number of loops, scanning speed, and focal position offset—on material removal was systematically investigated in both laminate and multilayer substrates. Empirical models were established for both substrate types, identifying significant factors and interactions that govern penetration depth with physical justification. Comparative analysis revealed that the multilayer model consistently predicted deeper penetration (6–17 µm) than the laminate model under identical conditions, primarily due to reduced heat-associated phenomena with prepreg, yet the laminate model offered a reasonable approximation for complex stack-ups. Rigorous validation through confirmation experiments, achieving 100% success in electrical integrity tests with compliant plug removal, unequivocally demonstrated the models’ robustness and reliability. This research provided a crucial tool for optimizing UV laser micromachining processes, significantly reducing parameter identification times and minimizing scrap generation, thereby enhancing the efficiency and reliability of advanced rigid–flex PCB manufacturing.