High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing

Li, Yunfan; Guo, Xuanqi; Wang, Shuai; Zhang, Shizhuo; Zhao, Yilin; Guo, Dingyi; Zhang, Chen; Liu, Sheng; Cheng, Gary J.; Liu, Feng

doi:10.3390/mi13091492

Open AccessArticle

High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing

by

Yunfan Li

¹,

Xuanqi Guo

¹,

Shuai Wang

²,

Shizhuo Zhang

²,

Yilin Zhao

¹,

Dingyi Guo

¹,

Chen Zhang

²,

Sheng Liu

¹,

Gary J. Cheng

^3,* and

Feng Liu

^1,*

¹

School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China

²

Institute of Technological Sciences, Wuhan University, Wuhan 430072, China

³

School of Industrial Engineering, Purdue University, West Lafayette, IN 47906, USA

^*

Authors to whom correspondence should be addressed.

Micromachines 2022, 13(9), 1492; https://doi.org/10.3390/mi13091492

Submission received: 16 August 2022 / Revised: 31 August 2022 / Accepted: 5 September 2022 / Published: 8 September 2022

(This article belongs to the Special Issue Micro/Nano-Machining of Functional Structures and Surfaces)

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Abstract

Copper (Cu) removal efficiency is a key parameter in the processing of Cu-based electronic devices. Herein, a nitrogen plasma-assisted picosecond (ps) laser process for Cu removal is presented. Based on the cleaning and activation effect of nitrogen plasma on the surface of Cu film in ps-laser ablation, the removal efficiency can be significantly improved. Theoretically, the interaction mechanism between Cu and the ps-laser under the action of the plasma flow field is investigated by the dual temperature model (TTM) and finite element analysis (FEA). Meanwhile, the experimental results show that the angle of the plasma flow significantly affects the laser ablation of Cu. Small-angle plasma helps to improve the ps-laser processing precision of Cu, while large-angle plasma can effectively improve the ps-laser processing efficiency of Cu. Under the laser fluence of 2.69 J/cm², the removal depth of the Cu film by a 30° plasma-assisted ps-laser is 148% higher than that by the non-plasma-assisted ps-laser, which indicates the application potential of nitrogen plasma in improving the laser ablation process.

Keywords: Cu removal; ps-laser; nitrogen plasma; high-efficiency

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MDPI and ACS Style

Li, Y.; Guo, X.; Wang, S.; Zhang, S.; Zhao, Y.; Guo, D.; Zhang, C.; Liu, S.; Cheng, G.J.; Liu, F. High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing. Micromachines 2022, 13, 1492. https://doi.org/10.3390/mi13091492

AMA Style

Li Y, Guo X, Wang S, Zhang S, Zhao Y, Guo D, Zhang C, Liu S, Cheng GJ, Liu F. High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing. Micromachines. 2022; 13(9):1492. https://doi.org/10.3390/mi13091492

Chicago/Turabian Style

Li, Yunfan, Xuanqi Guo, Shuai Wang, Shizhuo Zhang, Yilin Zhao, Dingyi Guo, Chen Zhang, Sheng Liu, Gary J. Cheng, and Feng Liu. 2022. "High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing" Micromachines 13, no. 9: 1492. https://doi.org/10.3390/mi13091492

APA Style

Li, Y., Guo, X., Wang, S., Zhang, S., Zhao, Y., Guo, D., Zhang, C., Liu, S., Cheng, G. J., & Liu, F. (2022). High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing. Micromachines, 13(9), 1492. https://doi.org/10.3390/mi13091492

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High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing

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