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Journal: Micromachines, 2022
Volume: 13
Number: 1908

Article: Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD
Authors: by Henk-Willem Veltkamp, Yves L. Janssens, Meint J. de Boer, Yiyuan Zhao, Remco J. Wiegerink, Niels R. Tas and Joost C. Lötters
Link: https://www.mdpi.com/2072-666X/13/11/1908

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