Special Issue "Advances in Multiscale and Multifield Solid Material Interfaces"
A special issue of Technologies (ISSN 2227-7080). This special issue belongs to the section "Innovations in Materials Processing".
Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 13541
Special Issue Editors
Interests: solid and structural mechanics; contact problems; shape memory alloys; elasticity
Special Issues, Collections and Topics in MDPI journals
Interests: structure mechanics; solid mechanics; computational mechanics; contact mechanics; modeling
Special Issues, Collections and Topics in MDPI journals
Interests: contact mechanics; interface mechanics; computational mechanics
Interests: engineering, applied and computational mathematics; mathematical analysis; mechanical engineering; mathematical modelling
Special Issue Information
Dear Colleagues,
Interfaces play an essential role in determining the mechanical properties and the structural integrity of a wide variety of technological materials.
As new manufacturing methods become available, interface engineering and architecturing at multiscale length levels in multi-physics materials open up to applications with high innovation potential.
This Special Issue is dedicated to recent advances in fundamental and applications of solid material interfaces.
Contributions concerning theoretical, numerical and experimental aspects are welcome from scientists working in different fields of material science and mechanics of materials.
Topics to be covered include, but are not limited to, the following:
- multi-scale modeling of interphases, thin films and surfaces, contact laws;
- models of imperfect, sliding, debonding or cohesive interfaces in composite materials;
- deformation, damage, fracture and other dissipative processes at interfaces;
- advanced finite element methods for the computational modeling of interfaces and surfaces;
- molecular dynamics simulations for interface design;
- recent developments of adhesive technology and materials.
Prof. Dr. Frédéric C. Lebon
Prof. Dr. Serge Dumont
Prof. Dr. Michele Serpilli
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- contact mechanics
- thin solid layers
- interface
- adhesion
- joints
- composites
- numerical simulations
- debonding
- smart adhesives
- coating