Innovations in Materials Processing
A section of Technologies (ISSN 2227-7080).
Technological growth in various engineering sectors is often limited by the lack of high performance materials. Performance of the materials crucially depends on how we process them into their final shape. Innovations in materials processing is thus a crucial area which principally governs the microstructure, properties and the performance of materials. In view of this the section on “Innovation in Materials Processing” focuses on the new developments related to primary and secondary processing of materials that ensures: (a) enhanced properties; (b) energy conservation; (c) reduced greenhouse gas emissions; (d) greener planet earth, and/or (e) improved production efficiency.
In particular (but not exclusively), this section invites contributions on:
- Solid Phase Processing includes techniques such as conventional powder metallurgy and 3D printing.
- Two Phase Processing includes techniques such as spray forming and rheocasting.
- Liquid Phase Processing includes various techniques based on liquid metals such as conventional casting, die casting, liquid forging, etc.
- Friction Stir Processing includes making alloys, composites, surface treatments and joining technologies.
- Microwave Processing includes the use of microwaves in synthesis and treating materials including, ceramics, polymers, metals and composites.
- Secondary Processing includes various aspects of techniques such as rolling, forging, and extrusion, targeted at improving properties of materials.
- Coating Techniques includes use of coating techniques, their methods and purposes to improve the functionality of the substrates.
Dr. Manoj Gupta
- solid phase processing
- two phase processing
- spray processing
- friction stir processing,
- microwave sintering
- coating techniques
Following special issues within this section are currently open for submissions:
- Reviews and Advances in Materials Processing (Deadline: 31 December 2020)
- Advances in Multiscale and Multifield Solid Material Interfaces (Deadline: 31 January 2021)
- New Advances in Microwave Technologies and Its Applications (Deadline: 15 March 2021)
- Smart Systems (SmaSys2019&2020) (Deadline: 31 March 2021)