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Special Issue "Smart Packaging: Flexible Sensors for Food Monitoring Applications"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 May 2018)

Special Issue Editors

Guest Editor
Dr. Sina Naficy

School of Chemical and Biomolecular Engineering, The University of Sydney, Sydney, NSW 2006, Australia
Website | E-Mail
Interests: smart materials; soft sensors; soft electronics; soft robotics; actuators
Guest Editor
Dr. Rona Chandrawati

School of Chemical and Biomolecular Engineering, The University of Sydney, Sydney, NSW 2006, Australia
Website | E-Mail
Interests: bionanotechnology; biosensors; nanoparticle sensors; drug delivery; food and health
Guest Editor
Dr. Hadi Heidari

School of Engineering, University of Glasgow, Glasgow G12 8QQ, UK
Website | E-Mail
Interests: analog integrated circuit design; wearable and implantable electronics; sensors and systems; magnetoelectronics and magnetic sensors; point-of-care diagnostics

Special Issue Information

Dear Colleagues,

Food waste is a major environmental and social problem around the world, with studies showing that more than one-third of global food is lost along the supply chain. It is estimated that two-thirds of food waste can be prevented if there were food sensors capable of evaluating food quality. While sensors are widely used in almost all aspects of human life, their implementation in food industry has been particularly sluggish. This is mainly because of the challenges that exist in incorporating “food-safe” sensors into “flexible” food packaging. The majority of the materials that are used in current sensor technology are not of food-grade or functional in wet environment. At the same time, the common sensors made of such materials are rigid and bulky. The combination of these factors highlights the level of delicacy that is required in the development of smart materials to be used in fabrication of flexible sensors for food industry.     

The aim of this Special Issue is to present the readers with a concise overview on recent developments and novel approaches in implementing sensors in food packaging. The proposed special issue will be dedicated to high-quality research articles, as well as original review papers, that highlight recent advancements in smart, functional materials and systems designed for food industry biosensing. A particular interest will be given to articles demonstrating “soft” materials that are capable of responding to pathogens, biologically active or toxic compounds, pH changes, temperature changes, and biological gases.

Potential topics include, but are not limited to:

  • Development of materials for biological sensors for the detection of microorganisms
  • Biological sensors with chemiresistive sensing mechanism
  • Potentiometric and amperometric biological sensors
  • Biological gas sensors for CO2, H2S, CH4, ethanol, etc.
  • Printable soft sensors for smart packaging
  • Emerging material and devices in stretchable, disposable, dissolvable, and biodegradable electronics for food monitoring systems
  • Sensor interface readout circuits for food monitoring systems

Dr. Sina Naficy
Dr. Rona Chandrawati
Dr. Hadi Heidari
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart packaging
  • flexible sensors
  • food sensors
  • food packaging

Published Papers

There is no accepted submissions to this special issue at this moment.
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
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