MEMS Transducers Design, Fabrication, Characterization, System Integration and Stability Performance

Dear Colleagues,

These days, several fields of society (IoT, industrial, automotive, consumer, medical, high-end) require the development of innovative miniaturized MEMS transducers with superior performance, and especially stability against temperature, humidity, aging, vibrations or other environmental perturbations.

In this Special Issue, a broad range of topics are discussed, including design, fabrication, characterization, packaging, and system integration of next-generation MEMS transducers. Papers discussing superior stability performance are especially welcome. Authors are encouraged to report scientific works on:

• innovative design or working principle of MEMS transducers, aiming at improved performance and associated electronic circuits;
• innovative fabrication technologies for transducers aiming at improved performance (e.g., nano gaps, NEMS sensing, 3D processes), and associated electronics;
• theoretical ultimate stability limits of state-of-the-art solutions (e.g., capacitive sensing, open-loop operation), validated by experimental measurements, and calibration/compensation techniques to go beyond such ultimate limits;
• emerging MEMS transducers (ultrasonic devices, optical mirrors, resonators) and associated circuitry;
• innovative applications of high stability transducers (with demonstrations), possibly assisted by aiding technologies.

The topics above can be developed for single-axis, single-quantity transducers (e.g., micromirrors, resonators), for multiaxis sensors, for combination of multiaxis sensors (e.g., 6-axis, 9-axis or N-axis inertial measurement units), and for system-in-package solutions.

Prof. Giacomo Langfelder
Guest Editor

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