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Intelligent Circuits and Sensing Technologies: Second Edition

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 20 February 2026 | Viewed by 755

Special Issue Editors


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Guest Editor
Department of Electrical and Computer Enginneering, University of Thessaly, Volos, Greece
Interests: model order reduction; thermal analysis; VLSI design; integrated circuits; electronic design automation; embedded systems; numerical analysis; circuit simulation
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Informatics and Telecommunications, University of Thessaly, Thessaly, Greece
Interests: intelligent systems; distributed systems; distributed intelligence
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Electrical and Computer Engineering, National Technical University of Athens, Athens, Greece
Interests: average and maximum power estimation and minimization; hardware security; low power design and architecture; reliability and verification of VLSI circuits; CAD system design; telecom and signal processing circuit optimization; wireless sensor networks and applications; sensor signal processing; safety and security; optimization theory and applications
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Laboratory of Medical Biology and Genetics, Department of Medicine, Aristotle University of Thessaloniki, 54124 Thessaloniki, Greece
Interests: cancers

Special Issue Information

Dear Colleagues, 

Smart sensing technologies and their inherent data processing techniques have drawn considerable research and industrial attention in recent years. More specifically, sensors are critical in our everyday life, as they are used to gather a diverse variety of information from a vast number of different sources. As a result, sensing technologies should offer a broad range of methods in order to gather data from various objects, obtaining precise information to monitor and control them.

Recent developments in nanometer CMOS technologies have shown great potential in dealing with the increasing demand of processing power that arises in these sensing technologies, from IoT applications to complicated medical devices. Moreover, circuit implementation, which could be based on a full analog or digital approach or, in most cases, on a mixed signal approach, plays a fundamental role in exploiting the full capabilities of sensing technologies. In addition, all circuit design methodologies include the optimization of several performance metrics, such as low power, low cost, small area, and high throughput, which impose critical challenges in the field of sensor design.

This Special Issue aims to highlight advances in the development, modeling, simulation, and implementations of integrated circuits for sensing technologies from the component level to complete sensing systems. Authors are encouraged to submit manuscripts for publication on (but not limited to) the following areas:

  • Low-power/low-cost circuit design for sensors;
  • Power management circuits for sensors;
  • Next-generation CMOS circuit design for sensor systems;
  • Intelligent front-end sensing circuits;
  • Circuit optimization methods for sensing technologies;
  • VLSI design of sensors for signal processing applications;
  • Interface circuits for data fusion from multiple sensors;
  • Sensor design for low-power edge computing and IoT applications;
  • Wearable sensor design;
  • Algorithms and signal processing methods to improve CMOS sensor design;
  • Sensor modeling and simulation.  

Dr. George Floros
Dr. Kostas Kolomvatsos
Prof. Dr. George Stamoulis
Dr. Savvas Petanidis
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • low-power/low-cost circuit design for sensors
  • power management circuits for sensors
  • next-generation CMOS circuit design for sensor systems
  • intelligent front-end sensing circuits
  • circuit optimization methods for sensing technologies
  • VLSI design of sensors for signal processing applications
  • interface circuits for data fusion from multiple sensors
  • sensor design for low-power edge computing and IoT applications
  • wearable sensor design
  • algorithms and signal processing methods to improve CMOS sensor design
  • sensor modeling and simulation

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Published Papers (1 paper)

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Research

12 pages, 3003 KiB  
Article
Construction of CPW Pogo Pin Probes for RFIC Measurements
by K. M. Lee, J. S. Kim, S. Ahn, E. Park, J. Myeong and M. Kim
Sensors 2025, 25(6), 1677; https://doi.org/10.3390/s25061677 - 8 Mar 2025
Viewed by 476
Abstract
A new radio frequency (RF) probe using pogo pin tips for integrated chip (IC) measurement up to 50 GHz is proposed. It offers high durability due to the pogo pins and meets three key design criteria for general IC measurement: (1) a 45° [...] Read more.
A new radio frequency (RF) probe using pogo pin tips for integrated chip (IC) measurement up to 50 GHz is proposed. It offers high durability due to the pogo pins and meets three key design criteria for general IC measurement: (1) a 45° tilted shape with a 70 μm tip protrusion for easy microscope inspection, (2) linear pogo pin alignment for commercial chip pad contact, and (3) a 250 μm pitch compatible with standard IC pad pitches. This design is distinct from traditional pogo pin probe cards which place pogo pins in vertical form, in a diagonal arrangement, and at wide intervals. The probe exhibits a low insertion loss of 1.6 dB at 45 GHz. A printed circuit board (PCB)-based calibration standard for the calibration of the designed probe is constructed, which is adjusted to inductance and capacitance values using a simulation to form the Vector Network Analyzer (VNA) calibration set. The measurements of a commercial amplifier IC using this probe show a nearly identical performance to commercial RF probes, confirming its accuracy and reliability. Full article
(This article belongs to the Special Issue Intelligent Circuits and Sensing Technologies: Second Edition)
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