Dear Colleagues,

There is an increasing demand for miniaturized, cost-effective, and reliable sensors and systems with advanced capabilities to monitor multiple environmental, physical, chemical, and biological parameters that address real-world challenges and improve people’s living standards. Flexible hybrid electronics (FHE) is a rapidly emerging research and development area with significant potential in revolutionizing the electronic manufacturing field in both industrial and consumer settings. This results in novel devices that can be applied for curved surfaces, complex geometries, and foldable applications, unlike conventional devices. FHE employs printed electronics (PE), advanced deposition processes, laser patterning/ablation processes, as well as semiconductor devices and packaging technologies. FHE enables roll-to-roll manufacturing in ambient conditions by utilizing high-throughput techniques, large area substrates, and multiple device fabrication per batch. This FHE-based interdisciplinary approach realizes the fabrication of miniaturized, low-cost, flexible sensors and systems with potential applications in aerospace, automotive, environmental, food, packaging, biomedical, and defense.

This Special Issue welcomes original research manuscripts as well as review articles on recent advances in materials and process development, characterization, fabrication technologies, key challenges, and opportunities in the FHE field. This issue’s aim is to bring together cutting-edge research and knowledge on the FHE, including:

• Biochemical, mechanical, optical and gas sensors
• 2D and 3D materials for flexible sensors
• Flexible and stretchable electronics
• Epidermal and biocompatible electronics
• Wearable and disposable healthcare devices
• Modelling, simulation, device integration and characterization
• Paper, textile and polymer substrates, and functional materials
• Energy harvesting and energy storage devices on flexible platforms

Dr. Dinesh Maddipatla
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.